As one of the traditional domestic home appliance brands, Hisense actually has launched mobile phone products, although sales and popularity may be poor, but Hisense has always had a good habit, that is, it will use a large proportion of pure domestic unigroup display chips.
Today, a new machine of Hisense appeared in the Ministry of Industry and Information Technology, which is also equipped with the chip of Unigroup ZhanRui, Tanggula T760.
The machine will be named Hisense F70, the Ministry of Industry and Information Technology data show that Tanggula T70 is an 8-core 2.2GHz main frequency processor, support LPDDR4X memory, and has UFS3.1 flash memory, this chip was released in the middle of last year, using 6nm process process, A76 *4 + A55 * 4 core architecture, equipped with Mail G57 GPU, in terms of performance benchmark is Snapdragon 765G.
In addition to other configurations, the F70 front is a 6.81-inch 1080P LCD screen, rear 48MP + 8MP + 2MP triple camera combination, front 8 million pixel selfie lens, battery capacity of 5000mAh, support 18W fast charging.
