Recently, a group of photos of hisense HNR553T new mobile phones were leaked from the Ministry of Industry and Information Technology, and the biggest highlight of this phone is the use of a new generation of self-developed chips: Tanggula T760.
The phone is named Hisense F70, equipped with a T760 chip is an 8-core 2.2GHz clock processor, supporting LPDDR4X memory, and has UFS3.1 flash memory.
The Tsinghua Unigroup T760 chip adopts 6nm EUVB process, A76*4+A55*4 core architecture, equipped with Mail G57 GPU, and benchmarks the Snapdragon 765G in terms of performance.
The screen adopts a 6.81-inch screen with 1080P resolution, supports 5x optical zoom, has a built-in 5000 mAh battery, 18W fast charge, supports 64GB-512GB memory, and is expected to be about 1599 yuan.
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