SMIC responded to rumors of co-construction with Huawei

IT House January 6 news, recently reported that Huawei is building a fab with the assistance of SMIC, trying to personally build a core to seek a breakthrough under the us chip ban blockade. The report also pointed out that Huawei's relevant personnel negotiated with TSMC's supply chain partners about purchasing equipment. At the same time, the report also "revealed" details such as SMIC South and local government funding.

In response to the rumor, SMIC responded today on the investor interactive platform that the semiconductor industry has received more attention from many parties and more information from various channels. The company's announcements and press conferences are subject to official channels.

Previously, Jiwei Network said that huawei relevant personnel said that the above content is false news. Many people close to SMIC also said that SMIC has never participated in or assisted Huawei in building a factory, and the cooperation between the two sides is only a legal and compliant business behavior at the level of wafer foundry, not a "group heating" development imagined by the outside world.

IT Home learned that Huawei established a Huawei Precision Manufacturing Co., Ltd. on December 28, the legal representative is Li Jianguo, the registered capital of 600 million yuan, the business scope includes: optical communication equipment manufacturing; optoelectronic device manufacturing; electronic components manufacturing; semiconductor discrete device manufacturing.

In this regard, some netizens speculated: could it be that Huawei wants to make chips itself?

Huawei insiders responded to this follow-up that Precision Manufacturing Co., Ltd. has a certain scale of mass production and small batch trial production (capabilities), but it is mainly used to meet the system integration needs of Huawei's own products. We do not produce chips, and our main business is the precision manufacturing of some core devices, modules, and components of Huawei's wireless, digital energy, and other products, including assembly and packaging and testing. The above-mentioned person said that the "semiconductor discrete devices" mentioned in the business scope are mainly the packaging and testing of discrete devices.