Sometimes, it is difficult to understand that the direction of technology research is the same, and the final result is also helpful for the improvement of the industry. But there are some people who like to be picky about Huawei's superposition technology, and now, Apple's two M1 Max spliced M1 Ultra chips, but no one and no one says that it is not. If there are really different faces, there will be different statements, but when the truth comes, how should these faces be put away?
Since March 9, the author has searched on the Internet, and what I see is praising Apple, such as "invincible", "too strong", "bullish", "Apple, how do you call them to chase?" And so on. Looking back, imagine that Huawei announced its chip superposition technology in June 2021, when a blogger "Kikuchang Pictures" was scolded and changed its name.
As shown in the figure:
Is it really good to treat differently?
Remember, at that time, Huawei's chip superposition technology was ridiculed by netizens as "void boiling"! Many netizens joked: two glasses of 50 ° water, added together is 100 °, really can boil! This point makes the Chinese people very uncomfortable, do not understand it, but the words can not be sprayed, let people think of the four words "bad intentions".
Power consumption is 90% lower than that of ordinary computer chips and so on. This technological breakthrough is indeed worthy of praise, after all, it is conducive to the development of the chip industry, we say it is impartial.
However, at the same time, this also proves the feasibility of chip stacking, and it does appear to be more performance, and it does not lose the same level of a single chip. Isn't it the same as the superposition technology proposed by Huawei, why can't you say something good, but have to ridicule and curse people?
Related technology research of other well-known enterprises
In fact, for chip stacking technology, is a chip packaging technology, there have been many countries and companies in the world to try, for example, in 2019, Intel through a technology called Coveros, the bundling of various vertical chip components, the realization of 3D chip superposition technology to improve performance.
For example, TSMC and Samsung, Intel and other giants have formed industry alliances for chip packaging technology to create standards for related small chip packaging and stacking technology, and promote the continuous progress of the electronic chip era.
Why is chip overlay technology present?
In fact, in the semiconductor industry, it has always been required to improve the semiconductor process to continuously reduce the line width, but the microcosm of the line width always has a limit, and the more difficult it is to pursue the back, so that there is no economic effect. Therefore, many companies are slowly adjusting their strategies to cope with this new difficulty, which is also the reason why 3D stacking chip technology came into being, which is also attracting much attention from the industry.
conclusion
That is to say, for the exploration of this technology, as long as there is a new breakthrough, it is an innovation, so is Huawei, and so is Apple. Therefore, when someone treats them differently, it just shows that the face is different, and the results of treating others are also different.
Conclusion
I hope that some netizens who like to scold people will correctly treat the matter of scientific and technological research and development, and do not immediately "boil" themselves as soon as there is "wind and grass". Don't treat domestic science and technology so "mean", a stinky face, treat foreign science and technology with "praise", a flattering look.
In fact, China's technology is constantly developing, there are many leading technologies, and supporting Chinese technology is not ugly. I believe that in the future, Chinese technology, as well as Chinese science and technology enterprises like Huawei, will get better and better.