【Jiaqin Comment】The sub-board full-board welding process scheme of the 5G base station circuit board invented by Guanghong Technology can be fixed separately on the carrier board and the sub-board through the carrier plate fixture and the secondary board fixture, and then the carrier plate fixture and the secondary board fixture are separated to achieve the smooth placement of the secondary board on the carrier board, which can effectively prevent the uneven placement from affecting the solder brushing effect, and can improve the full-board welding effect of the large secondary board in the production process of the 5G base station circuit board.
At present, the 5G base station circuit board loaded in the 5G base station equipment is generally large in size and is composed of a carrier board and a number of sub-boards attached to the carrier board. At the same time, the sub-board specifications of the 5G base station circuit board are generally smaller, and in the production process, the mounting between the sub-board and the carrier board is less difficult.
However, with the development of 5G technology, 5G base station circuit board in the production process, the size of the secondary board specifications gradually increased to slightly less than the width of the carrier board, these large sub-board mounted to the carrier board, the need for large secondary board full surface welding.
In the welding process, due to the large size and weight of the large sub-plate, the brush tin is easy to cause the placement of the sub-board unevenly, making the solder paste poor, and it is easy to produce bubbles, virtual welding and other undesirable phenomena. To this end, Guanghong Technology applied for an invention patent entitled "Welding Process and Welding Fixture Structure of The Secondary Board of 5G Base Station Circuit Board" on March 5, 2021 (application number: 202110242647.5), and the applicant is Huizhou Guanghong Technology Co., Ltd.
According to the relevant information currently published in the patent, let's take a look at this technical solution.
As shown above, is a schematic structural diagram of the welding fixture invented in the patent, the welding fixture structure mainly includes a carrier plate fixture 1 for placing the carrier plate and a secondary plate fixture 2 for supporting the secondary board, and the secondary plate fixture is provided with a plurality of support columns 201 wearing the carrier plate fixture. When used, the carrier plate fixture is superimposed on the secondary plate fixture, and the carrier plate is opened with a avoidance hole corresponding to the support column, and after the carrier plate is placed on the carrier plate fixture, the secondary plate is suspended on the carrier plate through multiple support columns.
Among them, the top of the support column is stepped, using the stepped structure to achieve the support column to the secondary board support and positioning, when the secondary board and the carrier board mounting, by separating the carrier plate fixture and the secondary plate fixture, so that the secondary board with the secondary plate fixture away from the carrier plate fixture and fall into the carrier plate. When the welding between the secondary board and the carrier board of the 5G base station circuit board is realized, the secondary board is placed flat on the carrier board to ensure the placement effect between the two, thereby improving the welding effect between the secondary board and the carrier board.
As shown above, the flowchart of the full-board welding process of the secondary board of the 5G base station circuit board, first, the carrier plate fixture is superimposed on the secondary plate fixture, so that a plurality of support columns 201 pass through the carrier plate fixture. Among them, in order to facilitate the superposition between the carrier plate fixture and the secondary plate fixture, the secondary plate clamp is provided with a positioning convex edge 202 matching the carrier plate fixture in the corner, and the positioning convex edge matches the corner shape of the carrier plate clamp, and the rapid positioning of the carrier plate fixture is realized by positioning the convex edge.
Secondly, the soldering post-load plate is placed in the carrier plate fixture, in order to ensure the welding effect between the carrier plate and the secondary board, the middle of the carrier plate clamp and the secondary board fixture are opened with a skeleton hole, the use of skeleton holes to ensure the heating of the solder paste and the heat dissipation of the circuit board, and the auxiliary board is fixed to the support column.
Finally, by separating the carrier plate clamp from the secondary plate fixture, the secondary board is attached to the brush solder position of the carrier board as the pillar descends, and the reflow soldering between the carrier plate and the sub-board is carried out, so that the soldering between the carrier plate and the secondary board is completed.
The above is the 5G base station circuit board of Guanghong Technology invented the sub-board full-board welding process, the scheme through the carrier plate fixture and the secondary board fixture to fix the carrier board and the sub-board respectively, and then use the carrier plate fixture and the secondary board fixture to achieve the secondary board smoothly attached to the carrier board, can effectively prevent the placement of uneven on the brushing effect of the effect, and can improve the 5G base station circuit board production process of the large secondary board welding effect.