Dear colleagues, partners and friends in the industry,
The 2024 Wide Bandgap Semiconductor Advanced Technology Innovation and Application Development Summit Forum will be held from June 5 to 7, 2024 at Grand Skylight International Hotel, Beijing. The purpose of this conference is to focus on the industrial chain of key materials, intelligent equipment, core devices and other industrial chains in the field of wide bandgap semiconductors, and work with industry elites to unlock the realization path of cost reduction and efficiency increase and high-quality development of the mainland wide bandgap semiconductor industry chain, improve the overall efficiency of the wide bandgap semiconductor innovation chain, and build a multi-dimensional communication and cooperation platform for the industry!
During the conference, Dongrong Electronics Co., Ltd. will exhibit the latest products and technologies at the booth, and we sincerely invite you to visit the booth for in-depth exchanges and discussions with us, and jointly explore the possibility of cooperation and development.
We look forward to your presence and believe that your participation will add more excitement and vitality to this conference. Let's work together to create brilliance!
Scan the QR code to register
01.
About Dongrong Electronics Co., Ltd
Founded in Hong Kong in 1993, Dongrong Electronics Co., Ltd. has been committed to providing customers with diversified, high-quality, efficient and satisfactory services in line with the business philosophy of "sincerity", "trust", "mutual assistance" and "win-win".
The company has set up offices in Shenzhen, Suzhou, Chengdu and Taiwan, providing reliable equipment and after-sales service for domestic customers from long crystal annealing, cutting, grinding, polishing, to wafer testing and packaging.
02.
Wonderful preview of the exhibits
Takatori多线切割机MWS-SiC6
Introduction to the device
This equipment is the world's first SiC special wire cutting equipment developed by Japan Takoro Company, which is most suitable for SiC cutting, with stable performance and excellent quality, and has many well-known enterprise customers in the industry.
Equipment features:
1. High rigidity structure for high-precision cutting
2. A control system to realize the stable operation of the equipment
3. Structural design to reduce consumables
4. Equipment monitoring and operation management functions
Takatori 油性切削油
Product Introduction:
As a leading company of multi-wire cutting equipment, Nippon Takatori uses "Blade-Y A I B A-" in combination with cutting machine equipment to improve cutting quality.
Equipment features:
1. High dispersion
2. Immortality
3. High adhesion
4. Liquidity
Dazhi Chemical OTD36-845 cleaning solution
Features:
1. Good cleaning effect, high removal ability of slurry
2. Good permeability, good rinse effect
3. Less metal ion residue
HAMAI grinder
Equipment Introduction:
The HAMAI 16BF precision four-drive surface polisher with star wheel drive system is designed to simultaneously polish both sides of the workpiece in a carriage between the upper and lower polishing discs, which are driven by a central and internal gear, and the polishing discs are driven independently of each other to pressurize the workpiece according to a pre-set program.
Equipment features:
1. Forward rotation and reverse control function of the star wheel
2. Specifications of 4 motors in the drive department
3. CPU tilt pressure control
4. Fluid bearing (Hamai patent)
适用领域:SiC GaN GaAs Si 蓝宝石 石英晶体等
Scan the QR code to register
03.
About the meeting
Meeting time and place
Meeting time
From June 5th to 7th, 2024, check in on the 5th
Meeting place
Grand Skylight International Hotel Beijing on the third floor of Grand Ballroom
(Building 10, China Aviation Technology Plaza, No. 15 Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing.)
Organizational structure
Organizers
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Organizers
Beijing North Huachuang Microelectronics Equipment Co., Ltd
Beijing Tianke Heda Semiconductor Co., Ltd
Co-organizers
Institute of Optoelectronic Technology, Beijing-Tianjin-Hebei National Technology Innovation Center
Henan United Precision Materials Co., Ltd
Tianjin Yufeng Carbon Co., Ltd
Huifeng Diamond Co., Ltd
Hangzhou Zhongsilicon Electronic Technology Co., Ltd
CETC Fenghua Information Equipment Co., Ltd
Topics to be discussed at the meeting
• Crystal growth, processing technology and related equipment technology;
• Core process technologies and equipment such as epitaxial material growth and chip manufacturing;
• Encapsulation materials, processes and equipment technologies;
• Reliability and failure analysis of wide bandgap semiconductor materials and devices;
• Application prospect of wide bandgap semiconductor devices;
• Analysis and improvement of product performance/yield/reliability and other factors;
• Thoughts and risks on production capacity;
• Solutions to promote process optimization, cost reduction and efficiency improvement;
• More hot topics......
Speaker
Registration
Participation fee
Ordinary delegates: 2,000 yuan/person,
Alliance member units to participate in the meeting: 1600 yuan/person
(Including meals and meeting materials, accommodation is at your own expense)
Please scan the QR code below to complete the registration
Conference contact
Phone:(010)50875766转721/722
E-mail:[email protected]
Business cooperation
Teacher Chen/13155757628
Register for the conference
Teacher Liu/18931699592
Teacher Hou/13811837211
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