Dear colleagues, partners and friends in the industry,
The 2024 Wide Bandgap Semiconductor Technology Innovation and Application Development Summit Forum will be held from June 5 to 7, 2024 at Grand Skylight International Hotel, Beijing. The purpose of this conference is to focus on the industrial chain of key materials, intelligent equipment, core devices and other industrial chains in the field of wide bandgap semiconductors, and work with industry elites to unlock the realization path of cost reduction and efficiency increase and high-quality development of the mainland wide bandgap semiconductor industry chain, improve the overall efficiency of the wide bandgap semiconductor innovation chain, and build a multi-dimensional communication and cooperation platform for the industry!
During the conference, Shenzhen Chuanyan Technology Co., Ltd. will exhibit the latest products and technologies at the booth, and we sincerely invite you to visit the booth to have in-depth exchanges and discussions with us, and jointly explore the possibility of cooperation and development.
We look forward to your presence and believe that your participation will add more excitement and vitality to this conference. Let's work together to create brilliance!
Scan the QR code to register
01.
About Shenzhen Chuanyan Technology Co., Ltd
Shenzhen Chuanyan Technology Co., Ltd. is a semiconductor CMP material supplier integrating R&D, manufacturing and sales. Chuanyan Technology is committed to promoting the development of domestic materials, with the purpose of domestic substitution, cost reduction and efficiency increase, and constantly breaking through the technological blockade and breaking the foreign monopoly. Consolidate the foundation of CMP materials and win the future of the semiconductor industry.
Since its establishment in 2011, Chuanyan Technology has always adhered to the concept of paying tribute to customers with high-quality products from the field of optics and optoelectronics to the field of semiconductors, and constantly pursued innovation to meet the different needs of customers and industries.
Chuanyan Technology advocates people-oriented, pays attention to the construction of employees' spiritual quality, and always firmly believes that the material and spiritual happiness of the team is the core competitiveness of enterprise development!
(Detailed products can be viewed directly to the official website WWW.SCIYEA.COM)
02.
Wonderful preview of the exhibits
Silicon carbide polishing slurry
Sciyea silicon carbide polishing slurry is developed and produced on the basis of strict control of particle size and improved particle surface characteristics. During processing, the aggregated crystalline particles rapidly fission and crush to meet the requirements for improved cutting forces and surface quality.
Diamond slurry
Sciyea diamond slurries include polycrystalline, monocrystalline, quasi-polycrystalline, nano, oily, and water-based. It is composed of high-quality diamond powder composite dispersant and dispersion medium, and the formula is diversified and suitable for different grinding and polishing processes and workpieces. The product has good dispersion, uniform particle size, complete specifications and stable quality, and can be widely used in grinding and polishing hard materials.
Synthetic polishing pads
The synthetic fiber polishing pad in Sciyea series products is mainly used for polishing process, which can be grooved and grooved according to the customer's process requirements, so as to increase the fluidity of the polishing slurry, improve the polishing efficiency and polishing accuracy, and have the characteristics of high polishing rate and good surface quality. It can replace similar imported products.
Damped cloth
Sciyea damping cloth is made of a variety of high-quality and delicate substrates, through dozens of complex processes such as drying and solidification. This cloth is mainly used in product finishing to meet the requirements of high roughness and high smoothness of the product surface.
Scan the QR code to register
03.
About the meeting
Meeting time and place
Meeting time
June 5-7, 2024
Meeting place
Grand Skylight International Hotel Beijing on the third floor of Grand Ballroom
(Building 10, China Aviation Technology Plaza, No. 15 Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing)
Organizational structure
Organizers
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Organizers
Beijing North Huachuang Microelectronics Equipment Co., Ltd
Beijing Tianke Heda Semiconductor Co., Ltd
Co-organizers
Institute of Optoelectronic Technology, Beijing-Tianjin-Hebei National Technology Innovation Center
Henan United Precision Materials Co., Ltd
Tianjin Yufeng Carbon Co., Ltd
Huifeng Diamond Co., Ltd
Hangzhou Zhongsilicon Electronic Technology Co., Ltd
CETC Fenghua Information Equipment Co., Ltd
Topics to be discussed at the meeting
• Crystal growth, processing technology and related equipment technology;
• Core process technologies and equipment such as epitaxial material growth and chip manufacturing;
• Encapsulation materials, processes and equipment technologies;
• Reliability and failure analysis of wide bandgap semiconductor materials and devices;
• Application prospect of wide bandgap semiconductor devices;
• Analysis and improvement of product performance/yield/reliability and other factors;
• Thoughts and risks on production capacity;
• Solutions to promote process optimization, cost reduction and efficiency improvement;
• More hot topics......
Meeting agenda
Registration
Participation fee
Ordinary delegates: 2,000 yuan/person,
Alliance member units to participate in the meeting: 1600 yuan/person
(Including meals and meeting materials, accommodation is at your own expense)
Please scan the QR code below to complete the registration
Conference contact
Phone:(010)50875766转721/722
E-mail:[email protected]
Business cooperation
Teacher Chen/13155757628
Register for the conference
Teacher Liu/18931699592
Teacher Hou/13811837211
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