According to the latest investigation by Bloomberg, Huawei and SMIC have submitted a patent for self-aligning quadruple pattern etching (SAQP) technology, that is, the manufacturing process of multi-exposure chips, and Huawei's latest patent (patent number CN117751427A) has also been found in the State Intellectual Property Office, which may mean that SMIC will not be able to achieve 5nm chip production in a short time!
Traditional chip fabrication relies heavily on complex and precise mask patterns to etch circuits, but as semiconductor processes continue to become more complex, the challenges and costs become more severe.
For example, to produce 2nm-class process chips, ASML has developed a next-generation EUV extreme ultraviolet lithography machine with a 0.55NA price of about $400 million. Under the severe constraints of external conditions, domestic semiconductor companies led by Huawei have been unable to obtain these cutting-edge processes, and must find other ways, such as advanced packaging technology and multiple exposure technology.
In short, multiple exposures divide the etching of chip circuit mask patterns into multiple steps, and can achieve similar or even better results than more advanced processes using relatively outdated technologies and equipment, i.e., 5nm chips made using 7nm devices. #华为芯片##中芯国际##光刻机##华为现在能做7纳米5纳米芯片吗? #
