Jiwei Network news, on the evening of April 12, Shanghai Silicon Industry announced the 2021 annual report, during the reporting period, the company's operating income was 2.467 billion yuan, an increase of 36.19% year-on-year; the net profit attributable to the owners of the parent company was 146 million yuan, an increase of 67.81% year-on-year; the net profit attributable to the owners of the parent company after deducting non-recurring gains and losses was -132 million yuan; and the basic earnings per share were 0.059 yuan.
Shanghai silicon industry said that the growth in operating income is mainly due to the strong demand for semiconductor market and the company's production capacity climbing, the production volume increased significantly, the company's 200mm and 300mm silicon wafer business revenue has increased. The increase in the company's profit was mainly due to the substantial increase in the company's 200mm and 300mm product shipments, and the gross profit margin of the products increased.
As of the end of the reporting period, the subsidiary Shanghai Xinsheng 300mm semiconductor wafer production capacity has completed the installation and construction of 300,000 pieces /month, and started the expansion and construction of 300,000 pieces /month; the total production capacity of the subsidiary Xinao Technology and Okmetic 200mm and below polishing wafers and epitaxial wafers exceeds 400,000 pieces/month; the total production capacity of subsidiary Xin'ao Technology and Okmetic 200mm and below SOI wafers exceeds 50,000 pieces/month.
Shanghai silicon industry said that during the reporting period, the company successfully created a comprehensive supply platform for 300mm semiconductor silicon wafers, technically realized the full coverage and large-scale sales of 300mm semiconductor silicon wafers 14nm and above logic processes and 3D storage processes, achieved full coverage of major domestic chip manufacturers in customers, and achieved full coverage of logic, storage, and image sensor (CIS) chips in downstream applications, solving the "card neck" problem of domestic 300mm large silicon wafer supply. During the reporting period, on the basis of the three "full coverage", the company's research and development capabilities continued to improve, product certification continued to advance, production capacity and shipments further increased, greatly improving the localization supply capacity of domestic 300mm semiconductor silicon wafers.
In addition, the company successfully passed the technical certification of 300mm semiconductor silicon wafer products for 14nm logic products, realized the batch supply of 300mm semiconductor silicon wafers for 14nm process node applications, successfully developed and verified 300mm semiconductor silicon wafers for 19nm DRAM, and made breakthrough progress; successfully passed the certification of 300mm polishing wafers for 64-layer and 128-layer 3D NAND applications, and realized large-scale supply.
During the reporting period, the company's subsidiary Shanghai Xinsheng successfully realized the leapfrog development from 40-28nm to 20-14nm advanced technology nodes, and then to the memory of defect-free silicon wafer technology, the number of available product specifications continues to increase, the advanced degree of process that can be applied to the product continues to increase, with the transformation of market supply and demand and the further expansion of the supply gap, while with the accumulation and improvement of the technical level, the certification cycle of the company's 300mm semiconductor silicon wafer products began to show a shortening trend. It is conducive to accelerating the rapid introduction and volume of the company's products in downstream customers.
Shanghai silicon industry pointed out that during the reporting period, the company's 300mm semiconductor silicon wafer 300,000 pieces / month production line construction was completed, becoming the largest production of 300mm semiconductor wafer positive products in China, and achieved full coverage of logic, storage, image sensor (CIS) and other applications of semiconductor silicon wafer company, capacity utilization and shipments continued to rise, at the end of the year to achieve the company's historical cumulative shipments exceeded 4 million pieces, shipments to a new level The capacity utilization rate of 200mm and below products (including SOI wafers) continues to maintain a high level, while expanding the capacity of 200mm SOI wafers, further improving production capacity through debottlenecking and improving production efficiency, and launching a 200mm epitaxial wafer expansion plan for automotive electronics applications to meet the growing market demand of downstream customers and further consolidate the supply advantages of 200mm and below products (including SOI wafers) in high-end segments.
For the 2022 business plan, Shanghai Silicon Industry said that considering the industry's high prosperity and strong demand, Germany's Silveronic and Japan's SUMCO have announced the launch of large-scale expansion plans, and the Singapore plant of German Silveronic has started construction in the second half of 2021. Based on the 5 billion yuan private placement and investment project, the company will rapidly expand the production capacity of 300mm semiconductor wafers and improve its technical capabilities, and seize the current market opportunities in the semiconductor industry.
Shanghai Xinsheng, a subsidiary of the company, is mainly engaged in the research and development, production and sales of 300mm semiconductor silicon wafers. The company plans to expand the production and technological upgrading of large silicon wafers, especially to upgrade to more advanced technology nodes, so as to achieve the layout of semiconductor silicon wafer products that can cover all sizes and categories, further expand the company's production and marketing scale, reduce unit costs, improve product quality, and optimize product structure to achieve performance growth and enhance the company's industry position and core competitiveness.
Okmetic, a subsidiary of the company, has been focusing on niche markets for high-end analog chips and silicon wafers for advanced sensors. The company has launched two new expansion projects at Okmetic to consolidate the company's established strengths in the 200mm high-end advanced wafer market.
The SOI wafers produced by the company's subsidiary, Xinao Technology, will continue to be applied to RF front-end chips, power devices, sensors and silicon photonic devices and other chip products on a large scale in the future. With the rapid development of terminal applications and the gradual improvement of the soi wafer ecological environment, various types of SOI wafers will usher in new development opportunities. The company will establish a supply capacity of SOI materials of various sizes to better meet market demand.
A number of internal cooperation projects have also been launched among the subsidiaries of the company to effectively utilize the various R&D, procurement and market resources within the group to maximize the synergy effect within the group and quickly build a "one-stop" silicon material platform with international competitiveness.
In addition, the company will be based on the needs of domestic chip manufacturing enterprises, focusing on domestic demand, accelerating the process of product certification, and striving to achieve multi-customer, multi-product synchronous promotion of certification work. At the same time, the company will pay close attention to the production plan of chip manufacturing production lines around the world, follow up in time, timely certification, and actively develop the market. (Proofreader/Li Zhengcao)