In 2021, Mini LEDs began to accelerate the landing. In particular, Mini direct displays continue to land in various application fields, and products such as TVs, laptops, and PADs equipped with Mini backlights continue to emerge.
While the downstream market demand grew strongly, the pace of expansion of midstream Mini LED packaging accelerated, and Mini LED packaging materials such as glue and Mini solder paste were shipped vigorously.
This point has also been confirmed by the annual report data disclosed by CHENRI Technology, a major manufacturer of LED solder paste materials.
The data shows that Chenri Technology achieved revenue of 98.0322 million yuan in 2021, an increase of 103.01% year-on-year, and net profit attributable to the mother was 15.1241 million yuan, an increase of 173.39% year-on-year. This also means that Chenri Technology will achieve a double increase of more than 100% in revenue and net profit in 2021.
Gaogong LED also noted that the gross profit margin of Chenri Technology in 2021 also reached 30.39%.
Chenri Technology is a national high-tech enterprise in the field of electronic fine chemicals, committed to the innovation of semiconductor packaging materials, LED packaging materials, electronic assembly materials, is the first in the field of LED packaging to propose flip-packing solid crystal solder paste, flip pectin glue solutions to provide.
At present, the main products of Chenri Technology are lead-free solder paste, high lead solder paste, silicone and so on. In recent years, Chenri Technology has continued to invest in research and development in key links of the industrial chain, and the preparation and application technology of solid crystal solder paste has reached the domestic advanced level, and has provided products and technical services for many packaging companies in the industry, and its market share has grown steadily.
Morning Day Technology said that in 2021, the company expanded its sales team, expanded its marketing efforts and continued to generate orders in the developed market, and its revenue grew rapidly.
The annual report shows that in the field of LED flip-up packaging, the domestic LED flip-packing industry in the upstream and downstream of the promotion of the scale of the continuous expansion, Chenri Technology is the industry's first proposed flip-packing solid crystal solder paste and upside-down glue material solution provider, solid crystal solder paste technology reached the international advanced level, has provided products and technical support services for a number of packaging listed companies, in the LED flip packaging key materials, Chenri Technology's solid crystal solder paste and glue products occupy an important market position.
In 2021, Chenri Technology has been widely used in product packaging needs of outdoor advertising screens, outdoor light boxes, car screens, stadiums and other multi-scenario product packaging needs. Its products such as adhesives developed by it are also becoming more and more mature in lamp bead products.
In addition to the field of outdoor LED display, Chenri Technology also carries out a comprehensive layout of packaging materials for automotive LED products. Through continuous innovation and research and development, it has passed the TATF16949 system certification as early as 2020.
The relevant person in charge of Morning Day Technology said, "At present, BOE, TCL, Ruifeng, Jufei, MTC, Absen, Guoxing and other enterprises have reached cooperation with us. ”
Up to now, Chenri Technology's solder paste products have covered LED lighting solder paste solutions, LED display solder paste solutions, and Mini solder paste solutions.
LED lighting solder paste solutions, including EM-6001 series, EM-7001 series, EM-6910 series, EM-9351 series, X4 series, Q4 series, mainly used for fine-pitch devices (QFP, etc.) mounting, medium and low temperature soldering process or secondary reflow process, can effectively protect the PCB and electronic components that cannot withstand high temperatures, IC electronic components soldering, etc.
LED display solder paste solutions, including G644 series, Q4 series, X4 series, mainly used for fine-pitch devices (QFP, etc.) mounting, IC electronic components soldering, etc.
Mini solder paste solutions, including EM-6001 series, EM-7001 series, EM-6910 series, EM-9351 series, X4 series, Q4 series, mainly used for MiniBLU lamp bead solid crystal soldering, printing process, RGB flip lamp bead, Mini LED device rework, IC electronic components soldering, etc.
While continuously expanding the scale of the solder paste market, Chenri Technology also actively lays out Mini encapsulant.
In the Mini encapsulant part, Chenri Technology is mainly divided into silicone system and epoxy system. According to Qian Xuexing, general manager of Chenri Technology, these two materials involve the efficiency and yield of Mini packaging, so Chenri invests a lot of research and development efforts in these two technologies to meet certain material characteristics, such as adhesion, hardness, strength, etc.
In the Part of the Mini display of epoxy adhesive, Chenri Technology is mainly divided into two major systems: amine system curing epoxy encapsulant and acid anhydride system curing epoxy encapsulant. Among them, the FR4 substrate COB shows that it is the amine system scheme used, which has the advantages of fast initial solidion, high stamping efficiency, high yield, low colloidal stress and small warpage; BT substrate RGB lamp beads use anhydride system scheme, high reliability of secondary reflux, and most importantly, cost reduction, which can meet the long-term needs of customers.