Huawei's kirin chip production capacity has led to Huawei's mobile phones being in a situation where no chips are available. Without the blessing of the Kirin chip, the market share of Huawei's mobile phones has plummeted, and Huawei's final solution is to use Qualcomm Snapdragon processors, while there is no 5G support. However, Huawei has exciting news has been exposed, and there is a solution for chips, but I personally feel that Huawei's chip solutions cannot be used on Huawei mobile phones, especially on Huawei Mate50.
Huawei's stacked chip patent exposed
Huawei has never given up on chip solutions, and previously exposed a set of patents applied for by Huawei, which are related to chip stacking technology. Huawei wants to achieve the performance of a 7nm process chip by stacking the 14nm process chip. After huawei's patent was exposed, the outside world has different opinions on the stacking technology of Huawei's Kirin chips, but Huawei officials have never expressed their position on stacking chip technology. However, it is surprising that Huawei's official chip stacking technology has finally relaxed, and the official officially recognized the existence of chip stacking technology.
Surprisingly, Huawei officially acknowledged the existence of chip stacking technology at the annual report conference. Huawei officials said that the principle of Huawei's stacking technology is to exchange performance with stacking and area for performance. Judging from Huawei's official statement, it seems that Huawei Kirin chips are hopeful that they will soon be used on Huawei mobile phones, and the domestic 14-nanometer process chip manufacturing technology has become mature, if the 14-nanometer chip can be mass-produced, then the stacking technology can make the 14-nanometer chip reach the performance level of the 7-nanometer process chip.
But here I may have to pour cold water on the majority of netizens!
Apple has already pioneered the adoption of this technology
In fact, chip stacking technology can be understood as a new chip packaging technology, such as Apple's newly released M1 Ultra chip, which is to package two Apple M1 Max chips, thus becoming a new Apple M1 Ultra chip. Apple M1 Ultra chip performance has been tested, Geekbench's single-core running score results, Apple M1 Ultra's single-core running score is not much stronger than Apple M1 MAX, but in the multi-core running score test results, Apple M1 Ultra score is 2 times that of Apple M1 Max, so from the performance point of view, the Apple M1 Ultra chip after stacking is indeed much stronger than Apple M1 Max, which also fully illustrates the advantages of stacking chips. And it's practical.
But Apple's M1 Ultra chip isn't perfect.
Stacked chips are not eligible for huawei Mate50
Huawei stacked chips can not be used on Huawei mobile phones, such as Huawei Mate50 has two main reasons, the first is the huge area of stacked chips. Comparing the size of the four chips of Apple M1 chip, Apple M1 Pro, Apple M1 Max and Apple M1 Ultra, it can be seen that the area size of Apple M1 Ultra chip is twice that of Apple M1 Max, and 8 times that of Apple M1. Judging from Apple's current use of stacked chips, if Huawei wants to use stacked chips, it cannot escape the problem of increasing chip area, and the increase in chip area also brings another problem is power consumption.
After the chip stacking, not only does the area increase, but the number of chip transistors also increases, so the power consumption of the chip will undoubtedly increase. Therefore, apple M1 Ultra's chip will not be used on portable devices, but can only be used on desktop-level devices such as MAC. In the same way, if Huawei's Kirin chip wants to be used on the mobile phone after stacking, not only the area of the motherboard needs to be increased, but also the heat dissipation of the mobile phone is also a problem, especially when encountering the peak of power consumption, how to solve the heat dissipation of two chips on the area of a mobile phone, at present, this problem is temporarily unsolved.