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No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

Today's Huawei in the mobile phone business pressure is very large, one of the reasons is that the chip has been restricted, resulting in the inability to supply normally, and then the new opportunities of friends are often released, which also leads to a great impact.

Although the influence of Huawei's mobile phones has always been very strong and the strength is not bad, it still takes some time to make a comprehensive breakthrough, otherwise it will have long supported 5G and announced a new Kirin chip.

But fortunately, Huawei has not been idle, from last year to now announced a lot of technology research and development news, whether it is screen driver chips or other aspects are gradually conquered.

Until recently, Huawei officials finally stopped installing, not only released a new technology, but also a lot of patents, it feels like a showdown.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

First, Huawei announced a technology patent on the package part of the chip in early April.

It is reported that the present application embodiment provides an electronic device, a chip packaging structure and a production method thereof, the chip packaging structure comprising: a substrate, at least one bridge board and at least two first chips.

That is to say, after having patents such as electronic devices, chip packaging structures and production methods, it also means that Huawei really wants to make efforts in this regard, and it should be possible to bring products for new machines.

The most important thing is that in addition to this patent, there is a new patent officially announced, which is also the reason why users feel that Huawei is not installed.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

Second, Huawei officially disclosed relevant patents on chip stacking technology.

It is reported that the patent was filed in September 2019, the patent involves the field of semiconductor technology, which can ensure the demand for power supply, while solving the problem of high cost caused by the use of silicon through-hole technology.

This means that Huawei is working hard to solve the problem of chip shortage, and Huawei's stacked chip design idea is to use the upper and lower stacking of two chips for packaging.

Simply put, it is to use area for performance and stack for performance, so that the less advanced process can continue to make Huawei competitive in future products.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

What needs to be understood is that for the part of silicon-based chip stacking technology, Huawei has actually studied and judged for a long time, including tests and methods, and the patent that is now published is only a patent display of one of the stacking methods.

Moreover, the Kirin processor has not been updated for a long time, and now that there is this new technology, it is still worth looking forward to whether the new generation of Kirin chips will meet us with stacking technology.

After all, the Kirin 9000 processor has been a long time since its birth, and in today's era, China still needs some fresh blood for mobile phones to stand on its feet.

Therefore, when this patent is released, it means that Huawei's future development is basically stable.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

Finally, there are some areas to worry about.

Before Huawei published the patent, Apple also used stacked chips, splicing the two chips on a flat surface and then achieving higher performance.

However, Huawei's idea of stacking chips is to connect the two chips in a way that is up and down, which means that the internal space of the product is more demanding.

Once more space is occupied, there are two situations that may occur, namely, the problem of heat dissipation is difficult to fully solve, and the lightness of the fuselage is difficult to control.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

In addition, at present, only the patent has been announced, and the stacked chip is expected to meet with us within 18 months, when everyone should see the application of related fields.

However, this time is not short, and Yu Chengdong has previously said that he will return to the king in 2023, so there is a great chance that he will meet with everyone in the market next year.

Coupled with the fact that the Huawei Mate50 series will become the highlight of this year, the Huawei P60 series should be released next year, and this technology should be adopted at that time.

In addition, I don't know if after the above patents, can we overcome the problem of 5G networks, after all, this is also the key that needs to be overcome.

No more? Huawei officially unveiled chip stacking technology, which is equivalent to a showdown

Exclusive view: Huawei mobile phone is the leader of domestic mobile phones, whether it is product design, hardware innovation or system experience is second to none in the industry, this time with new actions, it means that the future development speed will be faster. In this regard, what do you think, welcome to leave a message, like, share.

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