Previously, it was reported that Qualcomm was developing a new generation of smart wearable chipsets for the Snapdragon Wear series, and WinFuture.de brought us the first set of details about them. Snapdragon Wear 5100 and 5100+ are said to be in development, with a significant performance boost compared to the current Wear 4100 generation, and both new chips will be manufactured using Samsung Semiconductor's 4-nanometer process.
The Snapdragon Wear 5100 features a molded laser package (MLP) that separates the SoC from the power management IC. The Wear 5100+ will use a molded embedded package (MEP), which integrates SoC and PMIC in the same package. The Plus model will purportedly bring an additional QCC5100 coprocessor based on the ARM Cortex-M55, which is used in various smart peripherals such as Bluetooth headsets and will be able to handle data and Bluetooth connections completely independently, including notifications, while wear 5100+ itself will only be launched in tasks that require more computing requirements.
The two Snapdragon Wear 5100 chips will be equipped with four ARM Cortex-A53 cores at 1.7GHz, while also equipped with an Adreno 702 GPU operating at 700MHz. Both will support LPPDR4X memory, eMMC 5.1 storage, and an integrated ISP that can handle up to two camera sensors and 1080p video recording. The upcoming chipset is said to support both the full-fledged Android system and Google's Wear OS.
The Snapdragon Wear 5100 and 5100+ are still in development and are expected to launch later this year.
