Intel 12th Generation Core replaced the new interface/socket LGA1700, from the square (37.5×37.5 mm) of the previous two generations of LGA1200 to rectangular (37.5×45.0 mm), so the entire fixing bracket and fastener are redesigned.
However, the design of the LGA1700 socket seems to be underconsidered, the latch pressure is significantly greater than that of the LGA1200, and the change in the thickness of the 12th generation processor itself will cause the processor (exactly the center of the thermal top cover) to be slightly bent.
Although this will not affect the performance and life of the processor itself, it will drag down the heat dissipation effect, and the processor temperature will increase by a few degrees.
LGA1700
German media Igor's Lab once tried to add a 1 mm thick M4 gasket to the screw position in each of the four corners of the LGA1700 socket to share the lock pressure, and the result was really effective, and the processor temperature was instantly reduced by 5 °C.
Australian overclocking master Karta changed his mind, using advanced 3D printers and plastic materials to make an LGA1700 socket bracket, so as to adjust the height more precisely.
Another overclocking player, Luumi, tested the 3D printing bracket with an i5-12600K and an EVGA Z690 DARK KINGPIN, and the Prime95 roaster ran down to find that the temperature did not change.
However, he believes that it is likely that the water-cooled head that has been used many times has a convex surface itself, or it may be that the height of the bracket needs to be further precisely adjusted, but the pressure distribution of the 3D printed bracket is indeed much better.
Luumi said that it will also customize the new 3D printing bracket and adjust the height, hoping to achieve the same or even better heat dissipation effect as the gasket scheme.
