The U.S. Semiconductor Industry Association (SIA) released data on February 14, showing that global chip sales reached a record $555.9 billion in 2021, an increase of 26.2% year-on-year, and predicted that it will grow by 8.8% in 2022.
The association believes that sales in 2020 are up 6.8 percent from the previous year, and 2021 is the first year since 2018 that chip sales have exceeded one trillion.
SIA also said Chinese mainland remains the world's largest semiconductor market, with sales totaling $192.5 billion in 2021, up 27.1 percent, as did annual sales in Europe (27.3 percent), Asia Pacific/all regions (25.9 percent) and Japan (19.8 percent). From a regional perspective, the Americas market saw the largest increase in sales in 2021 (27.4%).
The Bluetooth Special Interest Group (SIG) released the "Bluetooth Market Update 2021", which predicts that although the growth rate of the Bluetooth market has slowed down in the past year, it is expected that by 2025, the annual shipment of Bluetooth devices will grow from 4 billion units in 2020 to more than 6 billion units.
While most markets have been affected by the COVID-19 pandemic, there are still some Bluetooth markets that have seen opportunities for growth. Over the past year, there has been an increase in the number of healthcare environments utilizing Bluetooth medical devices and solutions to minimize exposure risks and improve patient care. It is expected that by 2025, the deployment of Bluetooth medical location services will increase by 5 times on this basis. In addition, the global shift to working from home has driven the growth of Bluetooth PC accessories, with shipments of Bluetooth PC accessories reaching 153 million in 2020, 10% higher than last year's expectations. The growing public focus on health issues has also led to an increase in demand for Bluetooth wearables, with shipments of Bluetooth wearables expected to reach 205 million units in 2021. In addition, due to the global focus on safe return to work solutions, bluetooth real-time positioning system (RTLS) deployments are expected to reach 516,000 by 2025.
Lenz Technology launched a new 24-bit ADC Bluetooth BLE5.2 chip - ST17H69, which greatly improves the accuracy of the sphygmomanometer and oximeter, and with a Bluetooth function, it can be connected with the mobile app to better record your health data.
Lenz Technology launches the latest ST17H69 Bluetooth BLE5.2 chip
ST17H69 Bluetooth BLE5.2 chip is the latest 64-foot Bluetooth BLE chip from Lenz Technology, ARM Cortex-M0 32-bit processor, with 128KB-8MB system memory, Bluetooth protocol stack solidification, no longer occupy Flash space. 64KB of SRAM, partitioned to save more user data while in standby, can set up large-capacity buffers, and supports more complex functions. Support LCD screen drive, with 24-bit ADC, can be used as blood pressure blood oxygen application, SIG compliant ad hoc networking application. Includes multi-node control, as well as 2 masters and 4 slaves working simultaneously.
The biggest advantage is the reduced power consumption. The previous generation of Bluetooth receives peak current >13mA; The MCU consumes 0.5mA/MHz, and the average current in low-power mode >40uA. The new Bluetooth receives a peak current of 4mA and transmits a peak current of 4.6mA, which is the power consumption of the MCU
ST17H69 chip features
ARM CortexTM-M0 32-bit processor
128KB-8MB system flash, 64KB SRAM
2.4 GHz transceiver
Bluetooth Low Energy
SIG-Mesh Multi-Feature
Zigbee 3.0 Multi-protocol System on 24bit ADC
-20dBm to +10dBm transmit power
Receive current: 4mA @3.3v
Transmit current: 4.6mA @3.3v
1uA@sleep(IO wake up only)
AES-128 hardware encryption
PDM/I2C/SPI/UART/PWM/DMA
Lenz Technology has independent research and development of radio frequency and Bluetooth low energy BLE5.2 chip and has global intellectual property rights, for the AIoT Internet of Things field and individual consumers, to provide Bluetooth master control fully integrated chip "hardware and software commonality" solution and core devices, supporting a full range of APP software platform custom development. The designed Bluetooth chip solution is applied to smart wearable devices, Bluetooth indoor navigation, smart home, medical health, sports construction, data transmission, remote control, personal peripherals and AIoT Internet of Things and other scenarios.
The latest Bluetooth chip ST17H66 (SOP16) equipped with a high-performance and low-power 32-bit processor supports BluetoothLE and SIG MESH multifunctional Bluetooth 5.2.
Key parameters:
256 KB of system flash memory
64KB SRAM, all data is maintained constantly in sleep mode
Bluetooth Mesh
Receive current: 8mA
Transmit current: 8.6mA
0.3uA@sleep(IO wake up only)
AoA/AoD azimuth determination