Image source: Electronic Times
According to industry insiders, due to the increasing shortage of carrier boards for flip chip production, some B2B network chip suppliers are turning to QFN packaging technology, which has brought business opportunities to packaging factories with related technologies.
The Electronic Times report quoted the person as saying that MediaTek, Realtek and AsiaInfo are optimistic about their network chip sales prospects, and the quotation may rise further in 2022. But in order to better fulfill the large number of orders on hand, they are increasingly adopting QFN packaging.
Both MediaTek and Realtek use aQFN packaging technology developed in-house by Sun Moonlight. At the recently concluded CES, Realtek unveiled its first 10G Ethernet PHY chip with aQFN packaging technology for applications in PON (Passive Optical Network) and switches.
As QFN technology is increasingly used in chip solutions for automotive, networking, and industrial applications, the penetration of the technology is expected to skyrocket in 2022. Sources point out that this allows QFN lead frame manufacturers to see clear orders until mid-year.
In particular, in 2022 and beyond, with the growth trend of ESG management and intelligent manufacturing, the demand for Ethernet controller chips for industrial applications will rise significantly. This will push chipmakers to develop more advanced chip solutions to meet demand, which will also benefit their distributors and packaging and testing partners. (Proofreading/Jenny)
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