January 17 news, in the recent supply chain news pointed out that Apple has completed the A16 chip design required for the new generation of iPhone, is negotiating with TSMC to determine the FOUNDC matters.
The latest news pointed out that Apple accepted the price increase requirements of TSMC and packaged the production capacity of 120,000-150,000 4nm wafer wafers in TSMC, and its price increased by about 8-13% compared with 2021, but because it is the largest user of TSMC, the price will be preferential.
It is understood that the A16 chip that Apple will launch will use a 6-core SPECIFICATION CPU, which will support 5G dual-band, WIFI 6E, a new generation of LPDDR5 and other features, in addition to which it may also be used with Apple's self-developed baseband and used on a new generation of iPhones.
![3nm not on GAA stick to FinFET technology TSMC: the best cost choice[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)