Ultimate performance for the 5nm series! TSMC announces N4X process technology

IT House December 16 news, TSMC today announced the launch of N4X process technology, tailored for the demanding workloads of high-performance computing (HPC) products. The N4X is TSMC's first HPC-focused technology offering, representing the ultimate performance and highest clock frequency in the 5nm series. "X" is a technology developed by TSMC specifically for HPC.

Leveraging its experience in 5nm mass production, TSMC has further strengthened its technology to provide ideal functionality for high-performance computing products, creating the N4X. These features include:

Device design and architecture optimized for high drive current and maximum frequency

Back-end metal stack optimization for high-performance designs

Ultra-high density metal-insulator-metal capacitors enable powerful power transfer under extreme performance loads

IT House learned that these HPC features will improve the performance of the N4X by 15% compared to the N5, or 4% faster than the N4P, which is 1.2 volts. The N4X can achieve drive voltages in excess of 1.2 volts and provide additional performance. Customers can also take advantage of the N5 process's common design rules to accelerate the development of their N4X products. TSMC expects the N4X to enter risk production in the first half of 2023.

Dr. Kevin Zhang, Senior Vice President of Business Development at TSMC, said, "HPC is now TSMC's fastest-growing business area, and we are proud to introduce N4X, the first in our 'X' series of extreme performance semiconductor technologies. The demands in the HPC space are endless, and TSMC not only tailors our 'X' semiconductor technology to unleash the ultimate in performance, but also combines it with our 3DFabric advanced packaging technology to provide the best HPC platform. ”

TSMC said the company's HPC platform not only provides performance-optimized chips through N4X technology, but also provides maximum design flexibility through comprehensive 3DFabric advanced packaging technology and a broad design support platform with ecosystem partners through TSMC's open innovation platform.