I don't know how many small partners are waiting for the Tianji 9000 mobile phone to be listed recently? Although many small partners are looking forward to it, but in the current situation, at least in terms of release time and optional products, Tianji 9000 is not as good as imagined. Recently, MTK has caught fire because of two new chips, these two are the newly released Tianji 8100 and Tianji 8000, the former will be started by Redmi, and the latter will be launched by OPPO. Many people on the Internet regard it as the successor of Snapdragon 870, is that not the case?
Let's take a look at the specifications first. Tianji 8100 and Tianji 8000 are based on TSMC 5nm process manufacturing, in the architecture are 4 + 4 structure, by four A78 large core and four A55 small core, support up to 120Hz 4K screen or 168Hz full HD screen, GPU part is Mali-G610, basically is a reduced version of Tianji 9000. It also supports LPDDR5 memory and UFS3.1 flash memory, and the image part has a built-in 3X14bit ISP, and supports up to 3200W pixel triple cameras.
From the specification point of view, the most obvious thing compared with the Tianji 9000 is that there is no Cortex-X2 large core, and this large core is also suspected of increasing the power consumption of the CPU part. Compared with the Tianji 9000, the GPU part has shrunk significantly, and the performance has been directly cut by 40%, and the advantage of the Tianji 8100 is only increased in frequency than the Tianji 8000. If the analysis is wrong, directly cutting off the GPU performance is also a good way to control the heat, but it will also sacrifice a certain game experience, of course, this is all a reference to the performance of the Snapdragon 8 Gen1.
Will this Tianji 8100 and Tianji 8000 really become the same role as the Snapdragon 870? From the perspective of architectural design, it may not be as perfect as the Snapdragon 870. One of the advantages of Snapdragon 870 is the use of three-bush design, at this time it is not difficult to find that Snapdragon 865, Snapdragon 888 and even Snapdragon 8 Gen1, including Kirin 9000 are three-bush design. Why? The most plausible explanation is that the three-bundle structure is the optimal solution for the current performance. Mobile phones are to calculate the computing power of limited power consumption, in this case, four high-frequency A78s are not necessarily stronger than one high-frequency A78.
But the three-bush architecture also brings a little problem, that is, it will affect the deployment of the product. From the beginning of A77 to the present, in fact, the performance improvement brought by the core architecture improvement is very small, in this case, if the Tianji 8100 also adopts a three-bush architecture, it may face a very embarrassing situation, that is, the actual experience surpasses its own flagship. Can you accept that Tianji 8100 is better than Tianji 9000? Don't feel strange about this situation, after all, the Snapdragon 888 can't beat the Snapdragon 870, and the Snapdragon 8 Gen1 can't beat the Snapdragon 888.
So what we're seeing so far is that only chips that really focus on architectural advantages use three-bundle architectures, like the flagship products listed earlier. As for the flagship, they still use the 4+4 architecture, and tianji 8100 has not come up with the best solution for us. However, in the current market environment, Snapdragon 870 lacks carrier aggregation support, Snapdragon 888, Snapdragon 8 Gen1 continue to rot, Tianji 9000 is slow to disappear, Kirin 9000 is getting less and less, if you have to find a slightly reliable one in such an environment, it may be Tianji 8100.