The Intel client "core" and server "Xeon" CPU roadmap has been announced, and the product will be manufactured on the 5nm process in the second half of 2022 and will be used in the second half of 2023

Intel client "core" and server "Xeon" CPU roadmap revealed, the second half of 2022 products will be manufactured in the 5nm process, the second half of 2023 products will be manufactured in the 3nm process!

Intel is still on track to regain its lead in per watt transistor performance by 2025. Intel's advanced test and packaging technology has given it an industry leadership position that will benefit its product and foundry customers and will play a key role in the pursuit of Moore's Law. Continuous innovation is the cornerstone of Moore's Law, and innovation is very active at Intel.

In order to maintain its leading position, Intel will continue to exert efforts in the following aspects:

1. Process— Intel 7 is being manufactured and shipped in bulk, with 12th generation Intel ®® Core ™ processors and other products available in 2022. Intel 4 is the extreme ultraviolet (EUV) lithography technology we have implemented, which will be in production the following year and half of 2022. It improves transistor performance by approximately 20% per watt. Intel3 has additional features with a further 18% increase in performance per watt and will be in production in the second half of 2023. The Intel 20A ushered in the era of RibbonFET and PowerVia, with a 15% improvement in performance per watt and will be in production in the first half of 2024. The Intel 18A offers an additional 10% improvement and will be in production in the second half of 2024.

2. Packaging—Intel's advanced packaging leadership provides designers with options for thermal, power, high-speed signal, and interconnect density to maximize and collectively optimize product performance. In 2022, Intel will deliver leading packaging technology at Sapphire Rapids and Ponte Vecchio and begin risk production at Meteor Lake. Foveros Omni and Foveros Direct are our advanced packaging technologies launched at Intel Accelerated in July 2021 and will go into production in 2023.

3. Innovation — As Intel looks forward to technologies like high-NA EUV, RibbonFET, PowerVia, and Foveros Omni, and Direct, its leaders believe there's no end to innovation, and therefore Moore's Law. Intel is still not backing down in realizing its desire to provide about 1 trillion transistors in a single device by the end of the century.