This evening, Xiaomi Redmi officially announced the K50 e-sports version of the mobile phone's real machine internal disassembly diagram, and showed the internal heat dissipation system, the machine will be equipped with Snapdragon 8 Gen1 chip, in order to cope with chip heat, K50 e-sports version of the internal use of VC vaporizer plate, graphene with heat dissipation, the overall internal stack has been much stronger than xiaomi 12 Pro.
Dual VC heat dissipation, isolation of chips, batteries and other heat-generating semiconductor heat, and the use of heat vapor plate and graphene, Redmi this time some at any cost, Redmi K50 dual VC cooling system surface base reached 4860mm2, nearly double the Xiaomi 12 Pro's 2900mm2 faster.
Compared with the previous generation of Redmi K40 esports edition, K50 is indeed full of details in terms of chips, configuration, etc., and was officially released on February 16, which is very worth looking forward to!
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