The domestic mobile phone inner volume is becoming more and more serious, and major brands have also accelerated the iteration of new machines. The new Redmi K50 universe machine, which began to warm up last month, finally officially announced the release time on the third day of the New Year's construction, and the Redmi K50 e-sports version will be released live on the evening of February 16. Dare to call the e-sports version, naturally in terms of performance configuration must be full, according to redmi official introduction, K50 e-sports version equipped with Qualcomm Snapdragon 8 chip, will be the K series of "performance peak" flagship.
The Redmi K50 Esports Edition retains a lot of the design of the previous generation K40 game enhancement in appearance, such as shoulder buttons, lightning flash, and magic breathing lights. The camera module shape and bezel have been slightly changed. There are elements of game phones, but the shape is not exaggerated, and I personally think that the appearance is not bad.
In terms of performance, compared to the previous generation that may have made way for the Black Shark, using the MediaTek Tianji 1200 processor, this generation finally let go of the Qualcomm flagship Snapdragon 8 chip. And with LPDDR5 and UFS3.1, it also added the self-developed "IO Turbo read and write engine", which officially claims that decompression can be accelerated by 100% and copy speed by 300%.
However, Qualcomm Snapdragon 8 paper performance is very strong, the actual experience is "difficult to say", in this regard, you can ask those Snapdragon 8 flagship mobile phones released in January. The biggest problem is that the power consumption is too high, and the full release performance will cause the temperature of the mobile phone body to run out of control. In order to balance, the previous Snapdragon 8 flagship can only sacrifice performance to suppress the temperature of "Dragon 8".
So, can you control the heat of this chip and exert its due performance? The K50 Esports Edition opted for a stacked cooling system at any cost.
The heat dissipation official of the K50 e-sports version of the official declaration is to do "full-link innovation", from the whole machine structure, to chip heat conduction, VC heat transfer, graphite thermal diffusion, for the entire thermal link to do 5 major material upgrades, the whole link to improve the heat dissipation efficiency.
The use of dual VC heat dissipation plate heat dissipation, the heat dissipation area reached 4860mm, may be the largest in history. And the use of a new generation of ultra-thin stainless steel VC heat dissipation in the material. 300 mesh ultra-dense capillary structure, heat dissipation performance increased by 40%. At the same time, ultra-thin stainless steel also has the characteristics of lighter and stronger.
Redmi calls the K50 esports edition a "cold-blooded flagship" and seems to be very confident in its heat dissipation.
Other announced configurations include 120W fast charging, and with a 4700mAh battery, dual-cell design, it takes only 17 minutes to fully charge. In addition, VRS variable resolution rendering technology is supported, which can render each frame of the picture at different resolutions for characters and special effects, thereby improving game quality more efficiently and greatly reducing power consumption.
One More Thing！ It is reported that the K50 e-sports version also has a Mercedes-Benz AMG F1 team joint model, the team logo elements with the same color, carbon fiber pattern, but also added mercedes-Benz logo logo. This version is really exciting to think about!