The Redmi K50 series mobile phone has had a lot of exposure news, but the new phone case leaked, basically finalizing the back design of this phone.
From the rear shell of the Redmi K50 Pro mobile phone exposed this time, it can be seen that the rear camera module of the machine is arranged in a triangular shape, using a three-main camera scheme, and the flash is not a prototype but a long strip, with a multi-color fill light module inside.
And the Redmi K50 Pro mobile phone uses side fingerprints, the chip has been determined to be the first batch equipped with MediaTek Tianji 9000 chips, 4nm process has more than 1 million running points, the performance is not false Snapdragon 8 Gen1.
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![Lu Weibing said that the Redmi K50 black draft is very fierce, and its own product problems cannot be ignored[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)