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Another display driver IC packaging and testing manufacturer, Qizhong Technology, intends to IPO A shares, with more than 60% invention patents

Jiwei Network News, January 4 news, CITIC Construction Investment Securities recently issued a public announcement on the hefei Zhongzhong Technology Co., Ltd. counseling filing report.

Another display driver IC packaging and testing manufacturer, Qizhong Technology, intends to IPO A shares, with more than 60% invention patents

According to the disclosure, in December 2021, CITIC Construction Investment Securities was entrusted by Hefei Jizhong Technology Co., Ltd. (hereinafter referred to as "Zhongzhong Technology") to serve as the counseling institution for the initial public offering of shares by Zhongzhong Technology and listing on the Science and Technology Innovation Board, and the two parties signed a counseling agreement on an equal and voluntary basis.

Founded in January 2018, Zhongzhong Technology is a leading integrated circuit high-end advanced packaging and testing service provider in China, mainly engaged in display driver IC packaging and testing and power IC/RFIC wafer processing and testing services. The company's display drive IC packaging and testing services provide customers with gold bump processing (Bumping), thinning and traversing, electrical testing (CP), tape and roll film overcryptive packaging (COF), glass cladding packaging (COG) and flexible substrate cladding packaging and other services. The company's non-display drive IC packaging and testing provides services such as thick copper rewiring, bump processing, grafting, electrical testing and wafer-level chip packaging according to the customer's product category and different packaging methods.

According to the data of wisdom bud, the invention patents of Qizhong Technology Company account for more than 60%, and the current technology is concentrated in professional fields such as overcrystalline packaging, semiconductors, and packaging structures.

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