According to reports, Broadcom and MediaTek plan to launch Wi-Fi 7 SoC wireless chips in the first half of 2022, hoping to preemptively attack in the next generation of Wi-Fi scramble, which also seems to mean that the Wi-Fi 7 era will be more competitive.
Previously, it was reported that a considerable part of the Wi-Fi 7 wireless chip will be manufactured using the 6nm process, and TSMC is ready for this.
In contrast, Wi-Fi 6/6E dedicated chips use up to 16nm process. Obviously, under 6nm, not only will the chip be smaller, but the performance and power consumption will also be greatly improved.
Wi-Fi 7 is known as IEEE 802.11be. It introduces technologies such as 320MHz bandwidth, 4096-QAM, Multi-RU, multi-link operation, enhanced MU-MIMO, and multi-AP collaboration on the basis of Wi-Fi 6, making Wi-Fi 7 provide higher data transmission rates and lower latency than Wi-Fi 6.
In terms of speed, Wi-Fi 7 is expected to be able to support throughput of up to 30Gbps, which is about 3 times that of Wi-Fi 6.
Unexpectedly, at a time when Wi-Fi 6 is not yet fully popular, the next generation of Wi-Fi 7 will be killed quickly.
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