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Thermal analysis of a SiC MOSFET power module based on a bare die package

author：Wide Band Gap Alliance

Source: Electrical Appliances and Energy Efficiency Management Technology

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Thermal analysis of a SiC MOSFET power module based on a bare die package
Thermal analysis of a SiC MOSFET power module based on a bare die package
Thermal analysis of a SiC MOSFET power module based on a bare die package
Thermal analysis of a SiC MOSFET power module based on a bare die package
Thermal analysis of a SiC MOSFET power module based on a bare die package
Thermal analysis of a SiC MOSFET power module based on a bare die package

Source: Electrical Appliances & Energy Efficiency Management Technology

*Disclaimer: This article was originally written by the author. The content of the article is the author's personal point of view, and the wide bandgap semiconductor technology innovation alliance is reprinted only to convey a different point of view, and does not mean that the alliance agrees with or supports the view, if you have any objections, please contact us.

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