According to the official website of TSMC, the company announced today (December 16) the launch of the N4X process, which is said to represent the highest performance and maximum frequency of the 5nm family.
The suffix "X" is the first suffix used by TSMC Advanced Process, representing Extreme, which means that it was specially developed for high-performance computing, in fact, this is also TSMC's first process technology dedicated to high-performance computing.
N4X should be 4nm in TSMC's definition, but TSMC is honest, using the 5nm family of sayings, that is, acknowledging that it is actually a 5nm enhanced version.
In terms of microstructure, TSMC N4X optimizes the design and structure of components supporting high drive current and maximum frequency, optimizes the metal process of the rear section, and supports ultra-high density metal capacitors that transmit high power under extreme load.
In terms of metrics, the performance of the N4X is 15% better than that of the N5. Compared with N4P, the performance at 1.2V is also improved by 4%.
According to TSMC, the N4X can support drive voltages higher than 1.2V, resulting in higher output performance. The N4X is consistent with the N5 design kit and performs better with 3DFabric packaging technology.
It is reported that N4X will enter trial production in the first half of 2023.
Unfortunately, TSMC did not disclose the main customers of N4X, theoretically AMD, Intel, Qualcomm, IBM, etc. are possible, after all, in addition to server CPUs, GPUs, the first two also have FPGA products can be launched.
![TSMC increases 5nm process capacity monthly shipments to 150,000 wafers[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)