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With TSMC, Intel's process finally caught up with Apple?

With TSMC, Intel's process finally caught up with Apple?

Intel 14th Generation Core or use the TSMC 5nm process

Similar to Apple's M1 series chips

According to DigiTimes, Intel is considering using TSMC's 5nm process at least in part to make its 14th-generation Core "Meteor Lake" CPU, which is the same process used by Apple's M1 series chips. The Intel Meteor Lake chip announced last year will be its first multi-chip design, integrating an application processor, graphics processing unit, and connectivity chip into a single Intel Foveros advanced package.

With TSMC, Intel's process finally caught up with Apple?

Intel initially said that the Meteor Lake CPU would be manufactured using its own 7nm process, which it called "Intel 4." On a recent earnings call, Intel CEO Pat Gelsinger said Meteor Lake will be Intel's first product to be manufactured using Intel 4, with prototypes that have successfully launched Windows and Linux.

With TSMC, Intel's process finally caught up with Apple?

Now, Intel is considering placing an order for all chip parts used in Meteor Lake CPUs to TSMC, Apple's sole chip supplier. Meteor Lake's chip blocks will be contracted to TSMC's 5nm process production, rather than relying solely on Intel's own 7nm process. The move will reportedly help avoid delays in cpu production and release schedules.

With TSMC, Intel's process finally caught up with Apple?

Apple's A14 Bionic, A15 Bionic, M1, M1 Pro, M1 Max, and M1 Ultra chips were all manufactured using TSMC's 5nm process, and Intel's decision could help meteor Lake chips better compete with Apple's competitive custom chips. It is reported that TSMC has also received orders for chips for the iPhone 14 series using its 5nm process.

With TSMC, Intel's process finally caught up with Apple?

The source added that the potential order for the Meteor Lake CPU will be large enough to encourage TSMC to expand its manufacturing capacity of its 5nm chips by the end of the year, and Intel's Meteor Lake CPU will be launched in 2023.

Google Pixel Notepad folding screen specification exposure

External screen size 5.8 inches

Recently, according to industry insider Ross Young, The Folding Screen Pixel product that Google is preparing may use an inner folding design, and it will also be equipped with a smaller external screen. Among them, the external display may be similar to the Samsung Z Fold 4, the outer screen is 5.8 inches, and the screen ratio may be wider than 16:9.

With TSMC, Intel's process finally caught up with Apple?
With TSMC, Intel's process finally caught up with Apple?

From the screen information revealed, we can understand that Google Pixel products may have a relatively small body, the 6.19-inch inner screen after expansion is smaller than most conventional mobile phones on the market, and the external screen of 5.8 inches is one of the favorite sizes of many small-screen mobile phone enthusiasts.

With TSMC, Intel's process finally caught up with Apple?

According to the previous relevant information, Google's new folding screen product may be named Google Pixel Notepad, which will continue the body hardware of some old Pixel products. In terms of imaging, Google Pixel Notepad or will use a 12.3 million pixel IMX363 sensor as its main camera, but also equipped with a 12 million pixel ultra-wide angle lens, the sensor model should be IMX386, these sensors have appeared on the previous Google Pixel products. In addition, in the choice of core processor, this folding screen mobile phone may be equipped with Google's self-developed chip.

With TSMC, Intel's process finally caught up with Apple?

In addition, there is news that the Google Pixel Notepad may be released with the Pixel 7, and the time should be the autumn of this year.

Samsung Galaxy Z Flip 4 exterior design exposure

You will have a larger external screen

According to previous news, Samsung is expected to launch a new folding screen new machine in the second half of the year, including the landscape folding Galaxy Z Fold and the vertical folding Galaxy Z Flip, although it is still a while from the release, but the related exposure news has been quite a lot. Recently, DSCC's Ross Young released the latest news about this year's Galaxy Z Flip, mainly for external screen and battery upgrades.

With TSMC, Intel's process finally caught up with Apple?

According to Ross Young, Samsung will continue to expand the outer screen size of the Galaxy Z Flip, the original product Galaxy Z Flip 5G only has a 1.1-inch outer screen, the Galaxy Z Flip 3 upgraded to 1.9 inches, and the latest Galaxy Z Flip 4 will break through 2 inches to bring a better user experience, but he did not disclose the specific size.

With TSMC, Intel's process finally caught up with Apple?

In addition to the continuous increase in the outer screen, the battery of the Galaxy Z Flip 4 will also continue to increase, and according to the previous exposure, its battery capacity will reach 3400mAh (typical), which is 100mAh larger than the previous generation. Its overall design is expected to change little from the previous generation, still use the side of the capacitive fingerprint recognition, rather than the screen fingerprint, it is understood that Samsung has considered the screen fingerprint recognition, but need to expand the phone and then unlock, obviously not appropriate. In addition, the processor platform of the Galaxy Z Flip 4 will also be upgraded, and it is expected to be equipped with Snapdragon 8 Gen 1.

With TSMC, Intel's process finally caught up with Apple?

As far as the current exposure news is concerned, Samsung Galaxy Z Flip 4 is still a small makeover, and there will not be much change in the overall design, and the increase in the outer screen coupled with the blessing of the Snapdragon 8 processor, the battery only increased by 100mAh, whether it can guarantee a good endurance is still unknown.

Exposure of the iPhone 13 display supply chain excluded BOE

Due to changes to the OLED panel design

According to The Elec, some sources said that BOE may be asked by Apple to stop supplying the iPhone 13 due to changes in panel design.

With TSMC, Intel's process finally caught up with Apple?

BOE began supplying OLED panels to the 6.1-inch iPhone 13 model last year, but since February, the company's panel supply has fallen sharply. The reason for the early decline can be arguably the shortage of display drive ICs, which BOE purchased from LX Semicon, which in turn supplied more to LG.

With TSMC, Intel's process finally caught up with Apple?
With TSMC, Intel's process finally caught up with Apple?

However, sources said that this alone did not explain the sharp decline in BOE production. The most likely reason, the person said, was that BOE changed the design of the OLED panel, such as expanding the circuit width of the thin-film transistor, and then discovered by Apple. They said this could lead Apple to notify BOE to stop producing the iPhone 13 panel.

With TSMC, Intel's process finally caught up with Apple?

According to media analysis, Apple is unlikely to completely exclude BOE from the OLED panel supply chain, and for Apple, BOE's competition with Samsung displays and LG displays is conducive to driving down the supply price of OLED panels.

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