At the recent investor meeting, Intel announced a large number of new processors, new process progress, the strength is very fierce, before 2025 will be mass production of 5 generations of advanced technology, the launch of 4 generations of Core processors.
The 12th generation of Core Alder Lake that has just been launched uses the Intel 7 process, and the 13th generation of Core Raptor Lake that will be launched in the second half of this year will continue to use the Intel 7 process, improving production capacity and optimizing performance is the focus, and the 13th generation Core has added 8 performance cores this time, a total of 24 cores and 32 threads.
The 13th-generation Core Meteor Lake, which will be shipped in 2023 and upgraded to the Intel 4 process, will adopt a non-single chip design for the first time, flexibly integrate multiple small chip modules, including the next-generation hybrid architecture CPU, tGPU core display engine, AI acceleration unit, and very low power consumption.
Raja Koduri, an executive in charge of gpu business, revealed that the meteor Lake processor's architecture is very exciting, and it can provide unique level of performance with concentrated energy efficiency.
Because of this unique architecture, Raja Koduri said that the GPU on Meteor Lake can no longer even be called centralized/core display, and it is not quite right to call it a single display, and it seems that Intel needs to give this GPU a new name.
The next 15th generation of Core Arrow Lake will be released in 2024, adding the Intel 20A process for the first time (which can be roughly understood as the 2nm level), and also adding the external process N3 for the first time, that is, TSMC 3nm. Supporting two technologies, RibbonFET and PowerVia, it will achieve a performance improvement of about 15% per watt, and production will be put into production in the first half of 2024.
The 16th generation of Core Lunar Lake will be released after 2024, continuing to promote the IDM 2.0 process, combining inside and outside, of which the internal process is upgraded to Intel 18A (roughly equivalent to 1.8nm level), and the external process is not disclosed.
Intel's goal is to inherit more than 1 trillion transistors in a single device by 2030 through various technologies such as advanced process RibbonFETs, high-NA EUV lithography machines, Foveros 3D packaging, and so on.