AMD introduces the world's first data center CPU using 3D chip stacking

SANTA CLARA, Calif., March 21 , 21 March –- AMD announced the launch of the world's first data center CPU with 3D chip stacking, the third-generation AMD EPYC processor with AMD 3D V-Cache technology, code-named "Milan-X". Based on the "Zen 3" core architecture, these processors further expand the third-generation EPYC processor family and deliver up to 66% performance improvements over non-stacked third-generation AMD EPYC processors.

SANTA CLARA, Calif. – March 21, local time – AMD announced the launch of the world's first data center CPU with 3D chip stacking, the third-generation AMD EPYC processor with AMD3D V-Cache technology, code-named "Milan-X". Based on the "Zen 3" core architecture, these processors further expand the third-generation EPYC processor family and deliver up to 66% performance improvements over non-stacked third-generation AMD EPYC processors.

The new processor features industry-leading L3 cache, the same sockets, software compatibility, and modern security features as 3rd generation EPYC CPUs, while also delivering superior performance for technical computing workloads such as computational fluid dynamics (CFD), electronic design automation (EDA), and structural analysis. These workloads are key design tools for companies that need to model complex physical worlds to create models to test or validate engineering designs for the world's most innovative products.

Dan McNamara, Senior Vice President and General Manager, Server Business Unit, AMD, said, "Based on our ongoing momentum in the data center and our many industry firsts, the third-generation AMD EPYC processors with AMD 3D V-Cache technology showcase our leading design and packaging technologies, enabling us to bring the industry's first server processor built specifically for workloads with 3D chip stacking technology. Our newly adopted AMD 3D V-Cache technology processor delivers breakthrough performance for mission-critical technical computing workloads, resulting in better product design and faster time to market. "

Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit, said: "Customers are increasingly adopting data-rich applications, which is placing new demands on data center infrastructure. The shared vision of Micron and AMD is to deliver the full power of leading DDR5 memory for high-performance data center platforms. Our in-depth collaboration with AMD includes preparing for the AMD platform based on Micron's latest DDR5 solution, as well as bringing third-generation AMD EPYC processors with AMD 3D V-Cache technology into our own data centers, and we've seen up to 40% performance improvements in specific EDA workloads compared to third-generation AMD EPYC processors that don't feature AMD 3D V-Cache. ”

Industry-leading packaging technology innovation

Increases in cache size have always been a top priority for performance improvements, especially for technical compute workloads that rely heavily on large data sets. These workloads benefit from increased cache size, but 2D chip designs have a physical limit on the amount of cache that can be effectively built on the CPU. AMD 3D V-Cache technology addresses these physical challenges by combining AMD "Zen 3" cores with cache modules, increasing the number of L3 caches while minimizing latency and increasing throughput. This technology represents another innovation in CPU design and packaging and delivers breakthrough performance for targeted technology computing workloads.

Breakthrough performance

As the world's most powerful server processor for technical computing, the 3rd generation of AMD EPYC processors with AMD 3D V-Cache technology deliver faster results efficiencies for target workloads such as:

* EDA – The 16-core AMD EPYC 7373X CPU provides up to 66% faster emulation speed for Synopsys VCS compared to the EPYC 73F3 CPU.

* FEA – The 64-core AMD EPYC 7773X processor delivers enhanced performance in Altair Radioss simulation applications.

* CFD – The 32-core AMD EPYC 7573X processor solves more CFD issues per day while running ANSYS CFX.

These performances and capabilities will ultimately help customers deploy fewer servers and reduce data center energy consumption, thereby lowering total cost of ownership (TCO), reducing carbon emissions, and achieving their environmental sustainability goals.

Industry-wide ecological support

The third-generation AMD EPYC processors featuring AMD 3D V-Cache technology are now supported by a number of OEM partners, including Atos, Cisco, Dell Technologies, HPE, Lenovo, QCT, and Supermicro.

The third-generation AMD EPYC processors with AMD 3D V-Cache technology are also widely supported by AMD's software ecosystem partners, including Altair, Ansys, Cadence, Dassault Systèmes, Siemens, and Synopsys.

Microsoft Azure HBv3 virtual machines are now fully upgraded to the third generation OF AMD EPYC with AMD 3D V-Cache technology. Microsoft says the HBv3 virtual machine is the fastest deployed product ever on the Azure HPC platform, with up to 80 percent performance improvements for critical HPC workloads compared to the previous generation of HBv3 series virtual machines, thanks to amD 3D V-Cache support.