Jiwei Network report On April 23, Shijia Photonic released the first quarter report of 2022, saying that in the first quarter of this year, the company achieved revenue of 196 million yuan, an increase of 19.30% year-on-year; the net profit attributable to the shareholders of the listed company was 22.8461 million yuan, an increase of 266.38% year-on-year.
Shijia Photonic said that the performance growth is mainly due to the increase in operating income of various categories of products compared with the same period last year, especially the revenue of optical chips and device products has increased significantly, an increase of 30.83% year-on-year.
At the same time, Shijia Photon disclosed the 2021 annual report that in 2021, Shijia Photon achieved operating income of 817 million yuan, an increase of 21.70% year-on-year; net profit attributable to shareholders of listed companies was 50.1642 million yuan, an increase of 31.78% year-on-year.
In terms of products, Shijia Photonics' continuous investment in optical chips and device products has gradually achieved results, driven by AWG chip series products and DFB laser chip series products, the company's optical chip and device business revenue continues to show a growth trend, and the revenue of optical chips and device products in 2021 is 363.1888 million yuan, an increase of 15.22% over 2020. At the same time, the indoor optical cable and cable material business has also grown significantly, of which the indoor optical cable product revenue is 220.6438 million yuan, an increase of 21.84% over 2020; the cable material product revenue is 217.0826 million yuan, an increase of 36.65% over 2020.
This is also inseparable from the company's continuous investment in research and development. In 2021, Shijia Photonics invested 80 million yuan in R&D (an increase of 26.95% over the previous year's 63.023 million yuan), and the R&D investment was fully expensed, and the R&D investment accounted for 9.79% of the operating income. During the reporting period, the company increased its R&D investment around AWG chips and DFB laser chips, resulting in the company's R&D expense rate at a high level in the industry.
In terms of passive chips and devices, Sterga photonics is used in data center O-band, 4-channel CWDM AWG and LAN WDM AWG multiplexer and demultiplexer components to achieve mass sales, meeting the needs of many data center optical modules at home and abroad. Special channel and splitting ratio 1x5, 1x7, 1x9 splitter chips for FTTR have been developed and batch shipments have been realized; 1x256 splitter chips can be applied to FTTH 10G PON and higher speed PON networks; DWDM AWG chips for 400G ZR coherent transmission have been developed and supplied in small batches; and O-band cascaded MZI wavelength division multiplexers for data centers have been developed, and their performance basically meets commercial requirements Developed a heat-sensitive DWDM AWG chip for backbone networks
The performance meets the commercial requirements and realizes the small batch supply; the parallel optical component applied to the high-speed data center 400G DR4 has been developed, which has passed the industry mainstream customer verification and realized the small batch supply; the parallel optical component applied to the high-speed data center 800G DR8 has been developed and passed the industry mainstream customer verification.
In terms of active chips and device products, we continued to increase R&D investment and comprehensively optimized the process, and significantly improved the ability of MQW active region design, MOCVD epitaxial, electron beam grating, chip processing, and coupled packaging in DFB laser chips. The cumulative shipment volume of DFB laser chips for optical fiber access network exceeded 10 million, and achieved a breakthrough in the FTTR gigabit optical network market, completing the application verification and import of mainstream customers in the industry; chip specifications and types were further enriched, and 5G bearer optical networks used 10G CWDM DFB to complete 1271nm-1451nm chips and TO device sample verification, 25G DFB laser chips entered the customer reliability verification stage; for silicon optical technology high-speed optical module demand, Developed a high-power continuous wave (CW) DFB laser, completed the development of O-band LWDM DFB, C-band DWDM DFB and achieved small batch sales, completed the 1311nm CW DFB non-airtight application verification, and the newly developed CW light source combined with the polarization-preserving FA of the optical emission integrated device began to be sold in small batches.
In 2022, Shijia Photonics will rely on its own advanced passive and active wafer-level process platform, using the company's IDM advantages, the company will continue to increase R & D investment, closely follow the market demand and the development of cutting-edge technology, for gigabit broadband access, fiber to room, 400G/800G data center interconnection, backbone network 200G/400G coherent transmission and 5G construction and other development trends, develop a clear R & D direction and product evolution route, the development of non-equalized optical splitter, MZI low-loss wavelength division multiplexer, New products such as ultra-wideband DWDM AWGs, VOA arrays, high-speed and high-power CW DFB lasers for silicon optical applications, passive platforms are gradually transitioning to ultra-high refractive index processes, improving chip integration.
(Proofreading/Lee)