Whiplash January 24 news, in order to cope with the expected release of the iPhone 14 Pro camera upgrade in 2022, Sony will expand the CIS component outsourcing TSMC mature special process, in which the pixel layer chip for the first time by TSMC OEM. According to Apple's supply chain news, according to Sony's plan, the 48M pixel layer chip will use the 40nm process of TSMC NANCO Fab 14B factory, and the follow-up will be upgraded and expanded to use the 28nm mature special process, including the Zhongke Fab 15A plant, the Kaohsiung plant in Taiwan, which will soon start the construction of the factory, and the Japan Kumamoto joint venture fab JASM.
At the same time, Sony's logic layer chip equipped with the image signal processor (ISP) core will also be outsourced to TSMC, using the 22nm process of Fab 15A, but the color filter film and microlens process of the latter section will still be shipped to Sony's own factory in Japan to complete.
For Sony's transformation, industry analysis believes that it is mainly to cope with the demand for the iPhone 14 equipped with 48M pixel CIS components for the first time, which is the first time apple has upgraded the iPhone camera system after 7 years, but the size of the 48M pixel CIS chip is much larger than that of the 12M components, which means that the demand for wafer production capacity should be at least doubled, and Sony's own production capacity is obviously insufficient, so it is so decided.
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