Nexperia advanced packaging project signed in Dongguan, Guangdong Province Plans to invest 1.8 billion yuan Nexperia advanced packaging project signed and settled in Dongguan, Guangdong Province, plans to invest 1.8 billion yuan

<h1 toutiao-origin="h1" > Nexperia Advanced Packaging Project signed a contract in Dongguan, Guangdong Province, with a planned investment of 1.8 billion yuan</h1>

China Securities Network News (reporter Zhang Xingwang) on May 24, China Securities News reporter learned from Nexperia semiconductor that on May 21, Dongguan City, Guangdong Province, held a strategic emerging industry investment conference. A number of projects involving the fields of new generation information technology, high-end equipment, intelligent manufacturing, new materials, new energy, and digital economy were signed at the conference. Nexperia Semiconductor (China) Co., Ltd. plans to invest 1.8 billion yuan in advanced packaging projects, which is one of the important projects of the investment conference. Nexperia Semiconductor (China) Co., Ltd. advanced packaging project, located in Theaxia (China) Factory, Tianmei Community, Huangjiang Town, Dongguan City, Guangdong Province, is mainly used for industrial upgrading, and after upgrading, it introduces high-power MOSFETs and LFPAK advanced packaging production lines and original standard device products. Through the transformation of production and efficiency improvement, semiconductor packaging and testing intelligent factory automation and infrastructure construction sub-projects, the new production capacity of standard devices is about 7.8 billion pieces/year.