Summary: Copper CableNext?
Technology and cost factors have pushed the chip industry into the post-Moore era, and advanced packaging has become an important path for the development of integrated circuit technology in the post-Moore era.
There are two main types of advanced packaging: XY plane extension and Z-axis vertical stacking.
The definition of advanced packaging is the use of advanced design ideas and advanced integration processes to reconstruct the chip at the package level, and can effectively improve the packaging of high functional density of the system.
(1) Advanced packaging technology based on XY plane extension, mainly through RDL (ReDistribution Layer) for signal extension and interconnection;
(2) Advanced packaging technology based on Z-axis extension, mainly through TSV (Through Silicon Via) for signal extension and interconnection.
TSV technology enables electrical extension and interconnection of the Z-axis.
TSV technology
TGV, Through Glass Via, is a vertical electrical interconnection through a glass substrate. Corresponding to TSV (Through Silicon Via), it is considered a key technology for next-generation 3D integration as a possible alternative to silicon substrates.
With TSV technology, multiple chips can be stacked vertically and interconnected.
According to the different types of integration, it is divided into 2.5D TSV and 3D TSV, 2.5D TSV refers to the TSV located on the silicon interposer, and 3D TSV refers to the TSV that runs through the chip body and connects the upper and lower chips.
In a 3D TSV, the chips are in close proximity to each other, so there is less latency and shorter interconnect lengths, which reduces associated parasitics and allows the device to operate at higher frequencies, which translates into performance improvements and greater cost reduction.
The size range of TSVs is relatively large, with the large ones exceeding 100um and the small ones being less than 1um. With the improvement of the process level, TSV can be made smaller and smaller, and the density is getting larger and larger, and the current state-of-the-art process can make 100,000~1 million TSV on 1 square millimeter silicon wafer.
Compared with silicon-based interposers, glass interposers have significant advantages.
The glass adapter plate has six advantages: low cost, excellent high-frequency electrical properties, easy access to large-size ultra-thin glass substrates, simple process flow, strong mechanical stability, and a wide range of applications.
TGV process: hole formation/hole filling is the two core links, the technical difficulty is high, and the main methods are as follows.
Global landscape
Intel's clear use of glass substrates to defeat silicon substrates has attracted great interest and future vision from the industry for through-glass (TGV) technology and substrate performance.
In the future, Intel will produce system-in-packages (SiPs) for data centers, with dozens of small tiles, which can consume up to several kilowatts of power, and require very dense chiplet interconnects, while ensuring that the entire package is not bent by heat during production or use.
Domestically, the team of Professor Yu Daquan from the School of Electronic Science and Technology of Xiamen University has made a three-dimensional capacitor with low loss and high capacitance density using glass through vias and atomic layer deposition process.
At present, the global TGV market share is highly concentrated, and the core technology and high-end products are still in the hands of foreign advanced enterprises.
According to News Channel Nebraska Central 2022 data, the United States is the largest through-glass (TGV) wafer market, with about 46% market share. Europe is a close second, with about 25% of the market share.
Corning maintained its No. 1 position among the major players in the through-glass (TGV) wafer market. Corning accounts for 26% of the global TGV wafer production value market.
Including Corning, with the addition of LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, etc., the top five manufacturers in the world have a market share of more than 70%.
With the encouragement of domestic substitution and policies, China has a lot of room for development.
(Summary of related industrial chain enterprises, not recommended)