Dear colleagues, partners and friends in the industry,
The 2024 Wide Bandgap Semiconductor Technology Innovation and Application Development Summit Forum will be held from June 5 to 7, 2024 at Grand Skylight International Hotel, Beijing. The purpose of this conference is to focus on the industrial chain of key materials, intelligent equipment, core devices and other industrial chains in the field of wide bandgap semiconductors, and work with industry elites to unlock the realization path of cost reduction and efficiency increase and high-quality development of the mainland wide bandgap semiconductor industry chain, improve the overall efficiency of the wide bandgap semiconductor innovation chain, and build a multi-dimensional communication and cooperation platform for the industry!
During the conference, Yangfan Semiconductor (Jiangsu) Co., Ltd. will exhibit the latest products and technologies at the booth, and we sincerely invite you to visit the booth to have in-depth exchanges and discussions with us, and jointly explore the possibility of cooperation and development.
We look forward to your presence and believe that your participation will add more excitement and vitality to this conference. Let's work together to create brilliance!
Scan the QR code to register
01.
About Yangfan Semiconductor (Jiangsu) Co., Ltd
Yangfan Semiconductor (Jiangsu) Co., Ltd., established in August 2021, is an enterprise specializing in the customized processing of third-generation and fourth-generation semiconductor materials (technical services for material cutting, grinding and polishing).
The company has a team of experienced experts in the industry, a variety of advanced cutting, grinding, polishing, cleaning and testing equipment, can provide you with a series of services from custom processing, material characterization to out-of-the-box substrates. Since its establishment, the company has established good cooperative relations with many large domestic semiconductor material enterprises. In addition, we have developed a fast cutting process for diamond wire for silicon carbide (SiC) and gallium nitride (GaN) crystal materials, which can greatly reduce the cutting time while maintaining a surface shape index similar to that of mortar wire cutting. Combined with the efficient grinding and polishing cleaning process, you can achieve the cutting and polishing needs of 6-inch silicon carbide substrate within 24 hours.
The company's material cutting and polishing Chinese production line can provide customers with the output of the entire production line equipment, and provide perfect technical processes, so that customers can quickly enter mass production when they establish a cutting and polishing production line.
The company adheres to the concept of technology first, and is committed to becoming a professional semiconductor technology company integrating excellent semiconductor material processing, testing, process solutions, and whole line equipment design output (including process and data). We're here for you.
02.
Wonderful preview of the exhibits
SIC wafer processing process
After the homogeneous epitaxy of silicon carbide substrate fails, we remove the epitaxial layer, and then the silicon carbide substrate is milled and shipped to customers. It can greatly reduce the cost of customer extension investment.
SIC wafer processing process
The figure shows that the 6-inch production capacity of SIC automated production line is 38K/month; 2: It can support a variety of material requirements, compatible with 4/6/8 inches; 3: Support non-standard customization of customer production lines.
Scan the QR code to register
03.
About the meeting
Meeting time and place
Meeting time
From June 5th to 7th, 2024, check in on the 5th
Meeting place
Grand Skylight International Hotel Beijing on the third floor of Grand Ballroom
(Building 10, China Aviation Technology Plaza, No. 15 Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing)
Organizational structure
Organizers
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Organizers
Beijing North Huachuang Microelectronics Equipment Co., Ltd
Beijing Tianke Heda Semiconductor Co., Ltd
Co-organizers
Institute of Optoelectronic Technology, Beijing-Tianjin-Hebei National Technology Innovation Center
Henan United Precision Materials Co., Ltd
Tianjin Yufeng Carbon Co., Ltd
Huifeng Diamond Co., Ltd
Hangzhou Zhongsilicon Electronic Technology Co., Ltd
CETC Fenghua Information Equipment Co., Ltd
Topics to be discussed at the meeting
• Crystal growth, processing technology and related equipment technology;
• Core process technologies and equipment such as epitaxial material growth and chip manufacturing;
• Encapsulation materials, processes and equipment technologies;
• Reliability and failure analysis of wide bandgap semiconductor materials and devices;
• Application prospect of wide bandgap semiconductor devices;
• Analysis and improvement of product performance/yield/reliability and other factors;
• Thoughts and risks on production capacity;
• Solutions to promote process optimization, cost reduction and efficiency improvement;
• More hot topics......
Some of the attendees and invited guests
Liu Sheng is a professor at Wuhan University and an academician of the Chinese Academy of Sciences
Xiaolong Chen, Institute of Physics, Chinese Academy of Sciences, Researcher/Chairman of the Wide Bandgap Alliance
Lin Jian, Secretary General of Semiconductor Materials Branch of China Electronic Materials Industry Association
Ke Xu is a researcher at the Suzhou Institute of Nanotechnology, Chinese Academy of Sciences
Shen Bo is a professor at Peking University
Ma Lei, Professor, Tianjin University
Zheng Xuefeng, Professor, Xidian University
Yu Daquan is a professor at the School of Electronic Science and Technology, Xiamen University
Lei Guangyin is a researcher at Fudan University and the chief scientist of Qingchun Semiconductor
Yuan Xiong, founder and chairman of Archimedes Semiconductor (Hefei) Co., Ltd
Yang Xiaohui Chairman of Hangzhou Zhongsi Electronic Technology Co., Ltd
He Weiwei, General Manager of Shenzhen Basic Semiconductor Co., Ltd
Zhang Zesheng is the general manager of Beijing Lattice Field Semiconductor Co., Ltd
Gao Wei Rong is the vice president of Silicon Semiconductor and the general manager of the R&D center
Peng Tonghua is the executive deputy general manager of Beijing Tianke Heda Semiconductor Co., Ltd
Deng Xiaojun is the deputy general manager of FEP business unit of Beijing North Huachuang Microelectronics Equipment Co., Ltd
Li Haibin General Manager of Jingjin Electric (Beijing) Electric Drive Division
Chen Hao, Director of Power Electronics of Guangzhou Xiaopeng Automobile Technology Co., Ltd
Ou Xin is a researcher at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Title: Heterogeneous Integration Technology of Wide Bandgap Semiconductors
Lin Xuechun is a researcher at the Institute of Semiconductors, Chinese Academy of Sciences
Title: Research on Laser Vertical Stripping of Silicon Carbide Wafers
Li Yun is the deputy chief designer and senior engineer of the 55th Research Institute of China Electronics Technology Group Corporation
Title: Progress and Development Trend of Silicon Carbide Epitaxy Technology
Yu Bingwu is the chairman of Tianjin Yufeng Carbon Co., Ltd
Report Title: Domestic asphalt-based carbon fiber thermal insulation felt: Helping to reduce costs and increase efficiency for the wide bandgap semiconductor industry
Li Dongping, General Manager of Beijing InBev Energy Storage Division
Title: Application of power devices in energy storage converters
Li Haoran, Deputy General Manager of the Marketing Center of CETC Fenghua Information Equipment Co., Ltd
Title: Opportunities and Challenges of Domestic Substitution of SiC Defect Detection Equipment
Wang Sen, R&D Director of Henan United Precision Materials Co., Ltd
Title: Differences in C/Si Surfaces of Silicon Carbide Substrates and Design of Fluid Abrasives
Yang Mulong, Product Director of FEP Business Unit of Beijing North Huachuang Microelectronic Equipment Co., Ltd
Title: Solutions for Wide Bandgap Material Epitaxy Equipment
Li Zhengxin, Director of Zhengzhou Technology Center of Huifeng Diamond Co., Ltd
Title: R&D and Application of Micro and Nano Diamonds
Registration
Participation fee
Ordinary delegates: 2,000 yuan/person,
Alliance member units to participate in the meeting: 1600 yuan/person
(Including meals and meeting materials, accommodation is at your own expense)
Please scan the QR code below to complete the registration
Conference contact
Phone:(010)50875766转721/722
E-mail:[email protected]
Business cooperation
Teacher Chen/13155757628
Register for the conference
Teacher Liu/18931699592
Teacher Hou/13811837211
-END-