Dear colleagues, partners and friends in the industry,
The 2024 Wide Bandgap Semiconductor Technology Innovation and Application Development Summit Forum will be held from June 5 to 7, 2024 at Grand Skylight International Hotel, Beijing. The purpose of this conference is to focus on the industrial chain of key materials, intelligent equipment, core devices and other industrial chains in the field of wide bandgap semiconductors, and work with industry elites to unlock the realization path of cost reduction and efficiency increase and high-quality development of the mainland wide bandgap semiconductor industry chain, improve the overall efficiency of the wide bandgap semiconductor innovation chain, and build a multi-dimensional communication and cooperation platform for the industry!
During the conference, Inner Mongolia Jinghang Special Carbon Technology Co., Ltd. will exhibit the latest products and technologies at the booth, and we sincerely invite you to visit the booth for in-depth exchanges and discussions with us, and jointly explore the possibility of cooperation and development.
We look forward to your presence and believe that your participation will add more excitement and vitality to this conference. Let's work together to create brilliance!
Scan the QR code to register
01.
About Inner Mongolia Jinghang Special Carbon Technology Co., Ltd
Inner Mongolia Jinghang Special Carbon Technology Co., Ltd. is a high-tech enterprise focusing on the R&D, production and sales of isostatic graphite, graphite electrodes, carbon fiber high-temperature thermal field materials and new carbon material products. At present, the company's products have been widely used in aerospace mold manufacturing, SiC crystal growth, photovoltaic crystal growth, semiconductor silicon material growth, high-end metallurgy, industrial furnace, optical fiber preforms, optical fiber drawing, sapphire crystal growth, ion implantation, MOCVD and other industrial fields, which can provide customers with thermal field application technical services and scheme design. After years of development, the company has been highly recognized by customers and the industry. In line with the corporate values of "honesty and integrity, customer first, dedication, innovation and creation, pragmatism and diligence, loyalty and gratitude", we unswervingly take the road of "rejuvenating the enterprise with science and technology, strengthening the enterprise with talents", and the company is moving towards a modern enterprise with a new look.
02.
Wonderful preview of the exhibits
Graphite powder
The particle size is controllable, the purity is ≥ 99.9995%, and it is suitable for grinding, with the characteristics of high strength, high purity and wear resistance
Crystalline graphite accessories
Batch stability, long service life, purity single element control
Epitaxial graphite fittings
The batch is stable, the processing accuracy is high, and the coating coverage is uniform
Scan the QR code to register
03.
About the meeting
Meeting time and place
Meeting time
From June 5th to 7th, 2024, check in on the 5th
Meeting place
Grand Skylight International Hotel Beijing on the third floor of Grand Ballroom
(Building 10, China Aviation Technology Plaza, No. 15 Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing)
Organizational structure
Organizers
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Organizers
Beijing North Huachuang Microelectronics Equipment Co., Ltd
Beijing Tianke Heda Semiconductor Co., Ltd
Co-organizers
Institute of Optoelectronic Technology, Beijing-Tianjin-Hebei National Technology Innovation Center
Henan United Precision Materials Co., Ltd
Tianjin Yufeng Carbon Co., Ltd
Huifeng Diamond Co., Ltd
Hangzhou Zhongsilicon Electronic Technology Co., Ltd
CETC Fenghua Information Equipment Co., Ltd
Topics to be discussed at the meeting
• Crystal growth, processing technology and related equipment technology;
• Core process technologies and equipment such as epitaxial material growth and chip manufacturing;
• Encapsulation materials, processes and equipment technologies;
• Reliability and failure analysis of wide bandgap semiconductor materials and devices;
• Application prospect of wide bandgap semiconductor devices;
• Analysis and improvement of product performance/yield/reliability and other factors;
• Thoughts and risks on production capacity;
• Solutions to promote process optimization, cost reduction and efficiency improvement;
• More hot topics......
Some of the attendees and invited guests
Liu Sheng is a professor at Wuhan University and an academician of the Chinese Academy of Sciences
Xiaolong Chen, Institute of Physics, Chinese Academy of Sciences, Researcher/Chairman of the Wide Bandgap Alliance
Lin Jian, Secretary General of Semiconductor Materials Branch of China Electronic Materials Industry Association
Ke Xu is a researcher at the Suzhou Institute of Nanotechnology, Chinese Academy of Sciences
Shen Bo is a professor at Peking University
Ma Lei, Professor, Tianjin University
Zheng Xuefeng, Professor, Xidian University
Yu Daquan is a professor at the School of Electronic Science and Technology, Xiamen University
Lei Guangyin is a researcher at Fudan University and the chief scientist of Qingchun Semiconductor
Yuan Xiong, founder and chairman of Archimedes Semiconductor (Hefei) Co., Ltd
Yang Xiaohui Chairman of Hangzhou Zhongsi Electronic Technology Co., Ltd
He Weiwei, General Manager of Shenzhen Basic Semiconductor Co., Ltd
Zhang Zesheng is the general manager of Beijing Lattice Field Semiconductor Co., Ltd
Gao Wei Rong is the vice president of Silicon Semiconductor and the general manager of the R&D center
Peng Tonghua is the executive deputy general manager of Beijing Tianke Heda Semiconductor Co., Ltd
Deng Xiaojun is the deputy general manager of FEP business unit of Beijing North Huachuang Microelectronics Equipment Co., Ltd
Li Haibin General Manager of Jingjin Electric (Beijing) Electric Drive Division
Chen Hao, Director of Power Electronics of Guangzhou Xiaopeng Automobile Technology Co., Ltd
Ou Xin is a researcher at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Title: Heterogeneous Integration Technology of Wide Bandgap Semiconductors
Lin Xuechun is a researcher at the Institute of Semiconductors, Chinese Academy of Sciences
Title: Research on Laser Vertical Stripping of Silicon Carbide Wafers
Li Yun is the deputy chief designer and senior engineer of the 55th Research Institute of China Electronics Technology Group Corporation
Title: Progress and Development Trend of Silicon Carbide Epitaxy Technology
Yu Bingwu is the chairman of Tianjin Yufeng Carbon Co., Ltd
Report Title: Domestic asphalt-based carbon fiber thermal insulation felt: Helping to reduce costs and increase efficiency for the wide bandgap semiconductor industry
Li Dongping, General Manager of Beijing InBev Energy Storage Division
Title: Application of power devices in energy storage converters
Li Haoran, Deputy General Manager of the Marketing Center of CETC Fenghua Information Equipment Co., Ltd
Title: Opportunities and Challenges of Domestic Substitution of SiC Defect Detection Equipment
Wang Sen, R&D Director of Henan United Precision Materials Co., Ltd
Title: Differences in C/Si Surfaces of Silicon Carbide Substrates and Design of Fluid Abrasives
Yang Mulong, Product Director of FEP Business Unit of Beijing North Huachuang Microelectronic Equipment Co., Ltd
Title: Solutions for Wide Bandgap Material Epitaxy Equipment
Li Zhengxin, Director of Zhengzhou Technology Center of Huifeng Diamond Co., Ltd
Title: R&D and Application of Micro and Nano Diamonds
Registration
Participation fee
Ordinary delegates: 2,000 yuan/person,
Alliance member units to participate in the meeting: 1600 yuan/person
(Including meals and meeting materials, accommodation is at your own expense)
Please scan the QR code below to complete the registration
Conference contact
Phone:(010)50875766转721/722
E-mail:[email protected]
Business cooperation
Teacher Chen/13155757628
Register for the conference
Teacher Liu/18931699592
Teacher Hou/13811837211
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