【Key Technology】ASML High-NA EUV lithography machine has made a breakthrough and successfully printed 10nm linewidth patterns
According to foreign media news on April 18, the Dutch ASML company announced that its first high-NA extreme ultraviolet (EUV) lithography machine using a 0.55 numerical aperture (NA) projection optical system has successfully printed the first batch of patterns. This breakthrough is a major milestone for ASML and the entire field of high numerical aperture EUV lithography.
Comments: Lithography machine is one of the important production and processing equipment in the semiconductor industry. In recent years, in the case of relatively sluggish demand for consumer electronics, new demand for electric vehicles, wind and solar energy storage, and artificial intelligence has become a new driving force for the growth of the semiconductor industry, and the scale of the global lithography machine industry has maintained stable growth. According to the data, in 2023, the global semiconductor equipment shipment value will be 106.3 billion US dollars, of which the lithography machine market will account for about 24%. Therefore, according to statistics, the global lithography machine market size in 2023 will be around 25.512 billion US dollars, a slight decrease of 1.27% from the previous year and an increase of 49.28% from 2020. From the perspective of market competition, ASML is the absolute leader in global lithography machine manufacturing technology, and occupies the vast majority of the market share of the global lithography machine industry together with Canon and Nikon, leading the development of industrial technology.
The announcement means that ASML's lithography equipment equipped with a 0.55NA high numerical aperture lens can achieve ultra-high resolution of 8nm compared to the current EUV lithography machine with a resolution of 13nm, and this technology allows transistors to be printed in a single exposure that is 1.7 times smaller in size and 2.9 times higher in transistor density. This marks the arrival of a new phase in global EUV lithography technology. In the future, ASML will gradually tune its high numerical aperture EUV lithography system to optimal performance and gradually introduce the technology into the real world to eliminate the need for EUV double exposure, thereby simplifying the production process, increasing throughput and reducing costs. This will bring huge opportunities for the development of the global semiconductor industry, and it also shows that the possibility of large-scale realization of process chips below 3nm will be greatly improved in the future. Under this trend, the competition in the global semiconductor market will become increasingly fierce.
Figure 1: Changes in the global lithography machine market size from 2020 to 2023 (in USD billion)
Source: Zhiyan Consulting
The U.S. government announced plans to provide more than $6 billion in subsidies to Samsung Electronics
On April 15, local time, the U.S. Department of Commerce announced that the U.S. government would provide Samsung with a direct subsidy of $6.4 billion based on the CHIPS and Science Act to support the company's construction of semiconductor factories and related facilities in Texas. Samsung will expand its existing fab in Austin, Texas, while building a new fab, an advanced packaging facility and an R&D facility in Taylor, northeast of Austin.
【Key Event】The 2nd Changzhou Conference on the Development of Characteristic Process Semiconductor Industry in 2024 was grandly held
On April 18, the 2nd Changzhou Conference on the Development of Characteristic Process Semiconductor Industry in 2024 was held. Mayor Sheng Lei, Academician of the Chinese Academy of Sciences Hao Yue, Academician of the Chinese Academy of Engineering Wu Hanming, and Academician of the International Eurasian Academy of Sciences Wei Shaojun attended the event.
At the scene, five projects, Yihong Technology Intelligent Perception, Qingzhou Microelectronics MEMS Sensor, Purance Semiconductor RF Induction Powder Equipment, Zhuyuan Intelligent Manufacturing Virtual Sensor, and Mingyao Laser Solid-state Laser, were signed and settled in Longcheng Core Valley. Six experts, scholars, investors and corporate executives from Xidian University, Changzhou University, Xike Holdings and other universities, investment institutions and leading enterprises were awarded the "Talent Introduction Partner". Southeast University wearable electronics industry-education integration base was unveiled, the base will focus on related industries to carry out industry-education integration collaborative education, and cultivate more urgently needed talents and original innovative talents for industrial development.
【Key Event】The School of Integrated Circuits of Zhejiang University established a partnership with Corigine and Xinyunsheng
On April 15, the School of Integrated Circuits of Zhejiang University signed a contract with Corigine Electronic Technology Co., Ltd. and Xinyunsheng Electronic Technology Co., Ltd. to officially announce the establishment of a long-term strategic partnership, aiming to open up the channel of cutting-edge technology research and development on the industrial application end, overcome the problem of industrialization of scientific research achievements, and form an efficient two-way cycle from technology research and development to product landing.
At the signing ceremony, the "School of Integrated Circuits of Zhejiang University-Corigine-Digital Simulation and Prototype Verification Joint Laboratory" and "Zhejiang University School of Integrated Circuits-Xinyunsheng-New Generation Intelligent Computing Network Technology Joint Laboratory" were officially unveiled.
【Key Event】Jinyi New District Semiconductor Component Manufacturing Accelerator Project started
On April 18, the groundbreaking ceremony of the semiconductor component manufacturing accelerator project was held in Jinyi New District.
It is reported that the project has a total investment of 1.5 billion yuan, covers an area of 104.17 acres, with a construction area of 210,000 square meters, and plans to build 7 main buildings. The project is located in the Jinyi Lake science and technology innovation source, which integrates scientific and technological innovation research and development, higher education incubation, intelligent manufacturing and other functions, adjacent to Jinhua Science and Technology City, Jinhua Institute of Technology, Jinyi Expressway is close at hand, with superior location and convenient transportation.
After the completion of the project, it will be used to carry the incubation of scientific and technological achievements in the field of semiconductor components and scientific and technological innovation, realize the function of "incubator + accelerator", further expand the space for projects in the new area, and help the information and innovation industry in the new area to become better and stronger and build a new pattern of development.
【Key Event】Nenghua Semiconductor Zhangjiagang Manufacturing Center (Phase II) Project Started
On April 18, according to the official WeChat news of Zhangjiagang Economic Development Zone (Yangshe Town), the Zhangjiagang Manufacturing Center (Phase II) project of Nenghua Semiconductor officially started construction in the remanufacturing base of Zhangjiagang Economic and Technological Development Zone.
It is reported that the total investment of Nenghua Semiconductor Zhangjiagang Manufacturing Center (Phase II) project is 60 million yuan, planning to build production plants and supporting facilities, with a total construction area of about 10,000 square meters, using advanced semiconductor epitaxy, testing and other process technologies, purchasing MOCVD, XRD diffractometer, AFM atomic force microscope and other equipment, and building a new GaN epitaxial wafer production line. After the project is put into operation, it will form a monthly production capacity of 15,000 pieces of 6-inch GaN epitaxial wafers.
According to the data, Jiangsu Nenghua Microelectronics Technology Development Co., Ltd. is a high-tech enterprise mainly engaged in the design, research and development, production and sales of compound semiconductor high-performance wafers, power devices, chips and modules represented by GaN, with the most complete product line in the industry including epitaxial materials, power chips and devices, RF wafers, etc., and is a third-generation semiconductor leader in China.
【Key Enterprise】Huahong Manufacturing (Wuxi) Project FAB9 main plant was fully capped
On April 20, the FAB9 main plant of Huahong Manufacturing (Wuxi) project was fully capped, which was constructed by Sijian Group and Eleven Science and Technology Consortium, 30 days ahead of the planned construction period.
It is reported that Huahong Wuxi integrated circuit R&D and manufacturing base is the first manufacturing project of Huahong Group out of Shanghai and layout in the country. This project is the second phase of the project, with a total construction area of about 530,000 square meters, and will build a 12-inch special process production line with a monthly production capacity of 83,000 pieces.
According to previous news, on June 8, 2023, Huahong Hongli, a subsidiary of Huahong Group, launched the second phase of Huahong Wuxi Integrated Circuit R&D and Manufacturing Base in Wuxi High-tech Zone, with an investment of 6.7 billion US dollars. Relying on Hua Hong Semiconductor's world-leading characteristic process technology accumulated over the years, it focuses on automotive-grade chips, conducts in-depth layout and research and development in related process fields, and continues to improve its application in the fields of new energy vehicles, Internet of Things, new energy, and intelligent terminals.
It is understood that in August 2017, the first phase of Huahong Wuxi project settled in Wuxi High-tech Zone. It is expected that the monthly production capacity of the first and second phases of the project will reach 180,000 pieces after all the projects are put into production, and the Huahong Wuxi project will become the most advanced technology and the largest production scale of 12-inch characteristic process research and development and manufacturing base in China.
【Key Enterprise】Xinhua Semiconductor's annual output of 10,000 tons of electronic grade polysilicon project was completed
On April 18, Mengyuan Liujian released news showing that Inner Mongolia Xinhua Semiconductor Technology Co., Ltd.'s 10,000-ton annual high-purity electronic-grade polysilicon industrial cluster project was successfully completed and has now entered the trial production stage.
It is reported that the project is located in the Central Industrial Park, Jinhe Town, Saihan District, Hohhot City, Inner Mongolia, covering an area of 216,450 square meters, with a total construction area of 153,000 square meters and a total investment of about 2.8 billion yuan. After completion and production, it can achieve long-term and stable supply to global customers with an annual production capacity of 10,000 tons of high-purity electronic-grade polysilicon, 500 tons of electronic-grade dichlorodihydrosilicon, 3,000 tons of electronic-grade trichlorosilane and 3,000 tons of electronic-grade silicon tetrachloride to meet the global semiconductor market demand.
【Key Enterprise】Zhuo Rui Sichuang chip packaging and testing project signed
On April 18, the chip packaging and testing project of Zhuo Rui Sichuang was officially signed in Shenzhen. It is reported that the chip packaging and testing project plans to invest a total of about 2 billion yuan, covering a total area of about 60 acres, and will build a number of new chip (28 nanometer) packaging and testing production lines, and build a national laboratory in Qingjiangpu. After the project is put into operation, the expected production capacity is 150KK/month, and the output value is 2 billion/year.
【Key Enterprise】Seal Core Semiconductor Headquarters Project settled in Suzhou High-tech Zone
On April 17, the official WeChat account of "Suzhou High-tech Zone Release" announced that the Seal Core Semiconductor Headquarters project was signed and settled in Suzhou High-tech Zone, which will accelerate the breakthrough of key core technologies, deepen the cultivation of advantageous subdivisions, and add new impetus to the high-quality development of integrated circuit industry clusters.
It is reported that the signing of the seal core semiconductor will be built into a corporate headquarters, give full play to the advantages of R&D and innovation, introduce more high-end resource elements, launch more new technologies and new products, and the estimated output value is 1.5 billion yuan after reaching production.
It is understood that Seal Core Semiconductor focuses on high-performance network chips and solutions with independent intellectual property rights, facing the needs of customers in AI intelligent computing, cloud computing, operators and other industries, and is committed to building leading domestically produced, high-performance, programmable network chips, and focusing on service integration into the development of the digital economy.
【Key Event】Xi'an 8-inch high-performance characteristic process semiconductor chip production line project realizes "delivery of land is delivery"
On April 19, Xi'an High-tech Zone issued the "Land Transfer Form" and "Real Estate Property Certificate" of the 8-inch high-performance characteristic process semiconductor chip production line project to Shaanxi Electronic Core Industry Times Technology Co., Ltd. in the mode of "land delivery is the delivery of certificates".
It is reported that the 8-inch high-performance characteristic process semiconductor chip production line project is located in Xi'an High-tech Zone south of Zongyi Road, north of Zongsan Road, east of Baoba Road, west of Planning Road, with a total investment of 4.5 billion yuan, mainly to build an 8-inch high-performance characteristic process semiconductor chip production line and supporting facilities, after completion will fill the gap in the field of 8-inch semiconductor manufacturing in our province, with an estimated output value of 2.85 billion yuan.
According to previous news, the project will complete the project filing in September 2022 and strive to be completed and put into operation in 2024, after which the project will fill the gap in the 8-inch manufacturing field in Shaanxi Province.
It is understood that at the end of 2020, Xi'an High-tech Zone launched the pilot reform of "handing over the land and handing over the certificate", which ensured the rapid progress of a number of social and livelihood projects and industrial projects, and injected momentum into the construction of key projects.
【Key event】Nanming new photoelectric display industry chain project was signed
On April 21, the 2024 China Industrial Transfer and Development Docking Activity (Guizhou) opened in Guiyang. Nanming District and Shanghai Ziqilin Enterprise Management Co., Ltd. signed an investment cooperation agreement on Nanming's new optoelectronic display industry chain project.
According to the agreement, the two sides will integrate resource advantages and invest 2 billion yuan in Nanming Intelligent Manufacturing Industrial Park, including 1.48 billion yuan of foreign investment, to build production lines for optoelectronic products such as COB light strips, semiconductor devices, and new display equipment. After completion and operation, it is expected that the industrial output value above designated size will not be less than 16.4 billion yuan, and the comprehensive tax payment will not be less than 820 million yuan, effectively introducing capital, talents, technology and equipment, and further promoting the development of new display, semiconductor and other industrial clusters in Nanming District.
【Key Enterprise】Aoditech Semiconductor joined hands with Dinghua Intelligent to launch the MES project
On April 15th, Aodi Semiconductor (Nanjing) Co., Ltd. (hereinafter referred to as "Aodi Semiconductor") and Nanjing Dinghua Intelligent System Co., Ltd. (hereinafter referred to as "Dinghua Intelligent") held the MES project kick-off meeting. This collaboration will enable Aoditech to quickly respond to customer needs, provide customized services, and maintain technological leadership through the digitalization of production processes.
It is reported that with more than ten years of experience in precision cleaning of equipment parts accumulated in the semiconductor and display industry, as well as the production verification and cleaning technology of more than 1,000 parts, Aodit Semiconductor focuses on providing comprehensive production equipment pollution control solutions for the pan-semiconductor field. The cooperation with Dinghua's CIM system aims to build a digital workshop through the introduction of the Manufacturing Execution System (MES), realize the comprehensive control of the production task process, and ensure that each process card has a complete digital footprint in the factory, so as to improve the transparency and intelligence level of the workshop.
According to the data, Dinghua Intelligent adheres to the main direction of intelligent manufacturing, relying on advanced industrial software MES (Manufacturing Execution System), APS (Advanced Scheduling), semiconductor CIM digital solutions and other industrial software and data services, and continues to provide suitable smart factory digital solutions for customers in electronic semiconductors, discrete manufacturing and other industries.
【Key Enterprise】Xinyang Silicon Mi completed the B round of financing of over 100 million yuan
On April 21, according to the information released by Tianyancha APP, Xinyang Silicon Dense (Shanghai) Semiconductor Technology Co., Ltd. (hereinafter referred to as "Xinyang Silicon Secret") announced the completion of the B round of financing of over 100 million yuan. This round of financing was led by Guoxin Investment, followed by Shanghai Science and Technology Innovation and International Trade Industry Fund.
According to the data, Xinyang Silicon Dense was reorganized and established in April 2016 by Shanghai Xinyang Semiconductor Materials Co., Ltd. and Silicon Dense Four New Semiconductor Technology (Shanghai) Co., Ltd., which has built a R&D center test platform and manufacturing base, with complete R&D and production capacity. Focus on the R&D, production, sales and service of semiconductor wet process electroplating equipment and related wet equipment, and provide cost-effective new automatic electroplating machines. Its self-developed equipment includes horizontal electroplating equipment, electroless plating equipment, cleaning/degumming equipment, liquid supply systems, etc.
【Key Enterprise】Kangda New Materials Subsidiary plans to invest 289 million yuan in the construction of semiconductor photoresist photoinitiator project
On April 16, Kangda New Materials announced that after resolution, the company agreed to invest in the construction of photoinitiator technology research and industrialization projects, the core materials of semiconductor photoresists, by Xi'an Caijing Optoelectronics Technology Co., Ltd., a holding subsidiary.
According to the announcement, the research and industrialization project of photoinitiator technology, the core material of semiconductor photoresist, is planned to be built at No. 19, North Section of Weihua Road, Jingwei New Town, Xi'an Economic and Technological Development Zone, Shaanxi Province, with a total investment of 289 million yuan and a total scale of 603 tons / year of photoinitiator. The project can rely on the R&D platform and technical foundation of Caijing Optoelectronics to carry out theoretical, basic and applied technology research on the preparation technology of photoinitiator, a key material of semiconductor photoresist, and form systematic technical achievements. It is understood that at present, Caijing Optoelectronics has mastered the production technology and process of photoinitiator (PAC), the core raw material of positive photoresist for TFT liquid crystal panels, and photoinitiator (PAG) for semiconductor integrated circuit photoresist, and a number of products have been tested at target customers. On this basis, Caijing Optoelectronics intends to complete the research on product pilot and mass production process technology through the development of this project, and finally form the industrial production capacity of photoinitiators.
The purpose of this investment is to deepen the implementation of Kangda New Material's strategic layout of "new materials + electronic technology", further optimize the product structure of its holding subsidiary, Xi'an Caijing Optoelectronics, fill the domestic gap, realize domestic substitution, solve the problem of "stuck neck" of photoresist core materials, break through the international technology and market monopoly, and effectively improve the independent and controllable level of the mainland lithography industry chain.
【Key technology】Continental has developed the world's first gallium nitride quantum light source chip
On April 18, the Information and Quantum Laboratory of the University of Electronic Science and Technology of China, the Quantum Internet Frontier Research Center of Tianfu Jiangxi Laboratory cooperated with Tsinghua University and the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences to develop a gallium nitride quantum light source chip for the first time in the world, which is another important progress made by the "Ginkgo No. 1" metro quantum Internet research platform of the University of Electronic Science and Technology of China, and another innovative achievement made by Tianfu Jiangxi Laboratory in the field of key core technologies.
It is reported that the research team overcame technical problems such as the growth of high-quality GaN crystal films, waveguide sidewall and surface scattering losses through iterative electron beam exposure and dry etching processes, and applied GaN materials to quantum light source chips for the first time in the world. At present, quantum light source chips are mostly developed using silicon nitride and other materials, compared with gallium nitride quantum light source chips, which have made breakthroughs in key indicators such as the output wavelength range, and the output wavelength range has increased from 25.6 nm to 100 nm, and can develop towards monolithic integration.
This research work has been strongly supported by the National Science and Technology Innovation 2030 Major Project, the National Natural Science Foundation of China, and the Sichuan Provincial Science and Technology Program. Recently, the title of "Quantum Light Generation Based on GaN Microring toward Fully On-Chip Source" was published in the internationally renowned academic journal "Physical Review Letters", and was selected as "Physics Highlights" for key publicity and reporting.
It is understood that the Frontier Research Center of Quantum Internet of Tianfu Jiangxi Laboratory focuses on key core technologies in the field of quantum Internet. At present, the center is accelerating the layout of metro quantum Internet, quantum artificial intelligence, quantum information devices and other industrial directions, vigorously promoting the application of quantum empowerment of new quality productivity in government affairs, finance, medical treatment, health and other fields, and firmly planting the cutting-edge research and innovative application of quantum technology.
【Key Technologies】Samsung launched 10.7Gbps LPDDR5X DRAM optimized for AI applications
On April 17, Samsung Electronics announced that it has successfully developed an industry-leading 10.7Gbps LPDDR5X DRAM memory designed to meet the growing demand for AI applications. The LPDDR5X DRAM, which uses 12nm process technology, not only improves performance by more than 25% compared to the previous generation, but also improves capacity by more than 30% and achieves a 25% improvement in energy efficiency.
It is reported that the capacity of this new generation of LPDDR5X DRAM memory has been expanded to 32GB in a single package, which will greatly meet the demand for high-performance and large-capacity memory for device-side AI applications. The design highlights its ability to adjust and optimize power delivery modes based on workload frequencies and extend low-power mode bands to improve performance while reducing energy consumption. This feature gives the new product significant advantages in terms of improved battery life for mobile devices and lower total cost of ownership for servers.
Samsung Electronics' memory business unit said the launch of the new product marks a further consolidation of the company's leading position in low-power, high-performance memory. The company plans to start mass production of 10.7Gbps LPDDR5X DRAM in the second half of this year after completing the verification of mobile processor manufacturers and device manufacturers.
【Key event】The first domestic lithography machine for advanced packaging of large chips was delivered to the factory
On April 16, according to the official WeChat news of Guangzhou Industrial Investment and Yuehai Integration, the "Exposure Moment - 3D Heterogeneous Chip Packaging Technology Seminar" organized by Guangdong Microtechnology Industry Research Institute and the delivery ceremony of the first domestic large-chip advanced packaging special lithography machine was held in Guangdong Yuehai Integration Technology Co., Ltd., Zengcheng District, Guangzhou.
It is reported that the first domestic lithography machine for advanced packaging of large chips delivered to the factory this time was independently developed by Star Technology, which can provide lithography processing technology for the integrated manufacturing of Chiplet and 2.5D/3D large chips, and provide strong technical support for the completion of various functional chips of domestic artificial intelligence large chips.
The receiver of the lithography machine, Yuehai Integration, is an advanced packaging enterprise mainly initiated and controlled by Xingcheng Capital, Sensor Group and the TSV wafer-level advanced packaging team with the most experienced local experience in China, and is owned by state-owned assets in Guangdong Province, Guangzhou City and Zengcheng District, headquartered in the core area of Zengcheng Economic and Technological Development Zone, Guangzhou City, with a total planned investment of about RMB 6.6 billion.
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