Jiwei Network report Recently, according to the disclosure announcement of the Shanghai Stock Exchange, Guizhou Zhenhua Fengguang Semiconductor Co., Ltd. (hereinafter referred to as Zhenhua Fengguang) will be launched on the Science and Technology Innovation Board on April 15.
According to the data, Zhenhua Fengguang focuses on the design, packaging, testing and sales of highly reliable integrated circuits, and its main products include signal chains and power managers. Since its establishment, the company has been deeply rooted in the military integrated circuit market, through continuous research and development and innovation, has a perfect chip design platform, SiP full-process design platform and high reliability packaging design platform, with ceramics, metals, plastics and other forms of high reliability packaging capabilities, as well as electrical performance testing, mechanical testing, environmental testing, failure analysis and other complete testing capabilities.
Zhenhua Fengguang has always been around the signal chain and power manager and other products for design and development, continue to carry out product iteration and continuous expansion of product categories, has now formed a signal chain and power manager two categories of a total of more than 160 products, mainly used in aviation, aerospace, weapons, ships, electronics, nuclear industry and other high-tech fields, for airborne, bullet-borne, ship-borne, arrow-mounted, vehicle-mounted weapons and equipment to provide supporting equipment, to meet the above areas of supporting products full temperature zone, long life, corrosion resistance, radiation resistance, impact resistance and other high reliability requirements.
According to the prospectus, Zhenhua Fengguang intends to raise 1.2 billion yuan in this IPO, and will invest in high-reliability analog integrated circuit wafer manufacturing and advanced packaging and testing industrialization projects and R&D center construction projects.
Among them, the construction content of high-reliability analog integrated circuit wafer manufacturing and advanced packaging and testing industrialization projects is 72 sets of new process equipment (sets) for wafer manufacturing and 110 sets of new process equipment for advanced packaging and testing; the project construction goal is to build a 6-inch characteristic process line with a production capacity of 3k pieces/month. At the same time, the construction of an annual output of 2 million pieces of advanced packaging and testing production lines in the back road, the formation of silicon substrate processing and manufacturing, wafer-level, 2.5D, 3D packaging and testing capabilities. After the completion of the project, the overall delivery capacity of the company's highly reliable analog integrated circuit products will be increased by 2 million blocks per year.
The R&D center construction project is mainly to supplement the EDA design capabilities and collaborative design capabilities in the existing design platform.
Zhenhua Fengguang said that the construction of the fund-raising investment project is centered on the company's main business, focusing on improving the company's technology research and development and production strength, and is an upgrade, extension and supplement to the existing business. Relying on the existing management level and technology accumulation, the company will further enhance the management, R&D and production capacity through the investment project of raising funds, improve the amplifier, converter, interface driver, system packaging ASIC and power manager system, and realize the company's transformation from the existing design, packaging and testing operation mode to the vertical integration company model of IDM semiconductor integrating design, manufacturing, packaging and testing to sales of highly reliable analog integrated integrated circuits.
(Proofreading/Lee)