Hello, I'm Mao Xiaomao. Follow me and take you to the latest digital news every day!
"One Minute News" Article 309, thank you for reading.
OPPO's first self-developed AP chip or mass production in 2023
Recently, Aiji Micro News, OPPO's IC design subsidiary Shanghai Zheku has launched application processor (AP) and mobile phone system single chip (SoC) research and development, is expected to launch the first AP in 2023 and use TSMC 6 nanometer process production, in 2024 to launch a mobile phone SoC that integrates AP and Modem, and further use TSMC 4 nanometer process projection.
Previously, OPPO's self-developed NPU chip has been officially launched. On December 14, 2021, at OPPO's 2021 Annual Future Technology Conference, OPPO's first self-developed NPU chip, The Mariana MariSilicon X, was officially released.
Apple WWDC 2022 will take place on June 6
Apple has announced that WWDC 2022 will take place June 6-10. The developer conference is still online.
Apple plans to offer courses and labs to developers, allowing them to learn about new features and the new version of the system that will be launched at the launch. Apple will unveil iOS 16, iPadOS 16, macOS 13, tvOS 16 and watchOS 9 at the conference.
iPhone 14 Pro Max border black margin or narrower
Recently, MacRumors news, the latest CAD rendering shows that the iPhone 14 Pro Max screen border black edge is narrower, only 1.95 mm.
The iPhone 13 Pro Max screen has a black border width of 2.42 mm. This means that the iPhone 14 Pro Max's bezel black edge is reduced by 20%.
It is reported that the iPhone 14 Pro and Pro Max no longer use the notch screen design, but a long strip of holes + punches, the opening is 2.29 mm from the top bezel.
The new Xiaomi Mix FOLD is coming soon
A few days ago, according to digital blogger @i Ice Universe revealed that Xiaomi does not have a MIX digital series this year, but will launch a new MIX FOLD machine.
According to xiaomiui.net, Xiaomi may release the Xiaomi MIX FOLD 2 in June, code-named "zizhan", which has appeared in the IMEI database and the model is 22061218C.
In terms of size, the Xiaomi MIX FOLD 2 has an inner screen size of 8 inches and an outer screen size of 6.5 inches, which is close to the size of the Xiaomi MIX FOLD.
Previous blogger @digital chat station has said that the crease of Xiaomi MIX FOLD 2 is significantly better than the previous generation, and the inner screen and outer screen support high refresh rate to make up for the regret of Xiaomi MIX FOLD (Xiaomi MIX FOLD inner screen refresh rate is 60Hz).
As for core performance, the Xiaomi MIX FOLD 2 may be equipped with a Qualcomm Snapdragon 8 processor, or it may be equipped with a Qualcomm Snapdragon 8 Plus processor.
Previously, it was revealed that Qualcomm will release the Snapdragon 8 Plus processor in May this year, and the relevant terminals will appear in June.
China Post Hi nova9 SE 5G mobile phone or April 8 release
According to the news that the blogger "The factory director is a classmate of Guan", China Post Hi nova9 SE 5G will be released on the 8th of this month, the appearance is roughly the same as huawei nova9 SE, the processor uses Snapdragon 695, support 5G.
Released in October last year, the Snapdragon 695 5G chip offers global 5G support for millimeter wave and sub-6 GHz bands. Qualcomm says the platform has up to 30% GPU graphics rendering speeds and a 15% CPU performance boost (compared to the Snapdragon 690).
It is reported that China Post Hi nova9 SE has now passed the ministry of industry and information technology certification, the model is FIO-TL00.
Samsung releases the Galaxy S20 FE 2022 model
According to GSMArena, Samsung quietly launched the Galaxy S20 FE 2022 model in South Korea. The device appears to appear on KT and LG Uplus websites on April 1. But it's certain that this isn't an April Fool's joke.
The phone is identical to the original Galaxy S20 FE 5G (powered by the Snapdragon 865 chip), except that the AKG headphones have been removed from retail packaging and the price has dropped by 200,000 won.
The final price of the Samsung Galaxy S20 FE 2022 is 700,000 won (about 3668 yuan), and most buyers may also receive a carrier subsidy version. Users can identify this new model by the model NUMBER SM-G781NK22 (or SM-G781NK). Only cloud white, cloud lavender and cloud blue colors are available.
Huawei publishes a chip stacking package patent
Huawei has published a patent for chip stacking packaging and terminal equipment to solve the problem of high cost due to the use of silicon through-hole technology.
According to the patent information of the State Patent Office, Huawei Technologies Co., Ltd. disclosed a chip-related patent on April 5, with the publication number CN114287057A. The patent abstract shows that this is a chip stacking packaging and terminal device involving the field of semiconductor technology, which can ensure the power supply demand while solving the high cost problem caused by the use of silicon through-hole technology.
The patent document shows that the chip stack package (01) includes:
- the first chip (101) and the second chip (102) between the first trace structure (10) and the second trace structure (20);
- The active surface of the first chip (101) (S1) is oriented to the active surface of the second chip (102);
- The active plane (S1) of the first chip (101) includes the first overlapping region (A1) and the first non-overlapping region (C1), and the active surface (S2) of the second chip (102) includes the second overlapping region (A2) and the second non-overlapping region (C2);
- The first overlapping region (A1) overlaps the second overlapping region (A2), and the first overlapping region (A1) and the second overlapping region (A2) are connected;
- The first non-overlapping region (C1) is connected to the second trace structure (20);
- The second non-overlapping region (C2) is connected to the first trace structure (10).
Thank you for reading here, it is not easy to create, ask for attention, ask for likes, ask for comments, ask for forwards!