Fever seems to have been one of Qualcomm's difficult to solve problems, from Qualcomm's major products, to the Qualcomm Snapdragon 888 known as the dragon, Qualcomm Snapdragon's calorific value is always criticized, and in fact, the fever phenomenon is very normal, but serious fever is a process or manufacturing process problem, even If Qualcomm Snapdragon 8Gen1 this flagship chip, the performance of the Android camp first, but the fever is still very large, and this is also considered by many people to be Samsung OEM pot, is not we do not know.
But there is news that Qualcomm Snapdragon 8 Gen2 chip is coming, this time the foundry is TSMC, netizens are also looking forward to it, but whether the heat is large can only be known until the finished product is listed.
As a flagship chip, the heat of the market is half a year, Qualcomm Snapdragon 8 Gen1 at the end of last year to the beginning of this year there were a large number of new machines released, not surprisingly, toothpaste or crowded, Qualcomm will launch a Qualcomm Snapdragon 8 Plus version in the second half of the year, in addition to the Qualcomm Snapdragon 8 Gen2 chip launched at the beginning of next year.
In the foundry industry, TSMC's technology is still much ahead of Samsung, and it is rumored that the yield rate of the Qualcomm Snapdragon 8 Gen1 Plus chip by TSMC OEM has been greatly improved, and at the same time, in terms of heat, it is better than the system of Samsung FOUNDRY, then, in order to stabilize the market share, Qualcomm will inevitably use TSMC, although there is no competition from Huawei Kirin, but there is mediatek, its MediaTek Tianji 9000 has caught up in terms of performance. And in the heat control is better than Qualcomm, is not it.
So, if you think that Qualcomm Snapdragon 8 Gen Plus and Qualcomm Snapdragon 8 Gen2 are replaced by TSMC process, is there a better solution to the heat?