The USB PD fast charging protocol chip mainly plays the role of communication identification, output voltage control and regulation in the fast charging source. According to the different application scenarios, PD fast charging protocol chips can be divided into charging end (DFP), receiving terminal (UFP), dual role end (DRP) three types, such as common fast charger, you need to use DFP protocol chip.
Yunsi Semiconductor is a digital-analog hybrid integrated circuit design company under Fuman Electronics, mainly engaged in the design of chips such as power management (PMU), USB PD controller, general-purpose microcontroller (MCU), radio frequency identification card (RFID), mobile phone radio frequency front end (RF) and so on.
In the past two years, the shipment of USB PD protocol chips of Yunsi Semiconductor has achieved explosive growth, and it has also frequently appeared in the product dismantling cases of charging head networks, becoming a dark horse in the fast charging protocol chip market. Today's article mainly talks to you about the layout and product cases of Cloud Silicon Semiconductor in the protocol chip market.
Cloud silicon semiconductor USB PD fast charging chip layout
According to the charging head network, Yunsi Semiconductor has launched 12 popular fast charging protocol chips for the USB PD fast charging market, most of which have passed the USB PD3.0 certification of the USB-IF Association, and the performance is stable and reliable. In addition, the whole series of chips are compatible with USB PD3.0, PPS, QC3+, QC3.0, QC2.0, FCP, SCP, AFC, BC1.2, Apple 2.4A and other mainstream charging protocols, which are used in fast charging chargers, which can meet the fast charging needs of most mobile phones, laptops and other products.
The USB PD fast charging protocol chip launched by Yunsi Semiconductor is mainly a DFP type, which can be divided into 36W and 65W types according to the power distinction, which is suitable for the design of PD fast charger, car charger and other power accessories within 65W.
From the perspective of interface control, Yunsi Semiconductor has launched a single-port fast charging protocol chip, but also laid out a single-chip solution with A+C dual-port and A+A+C three-port output, and adopts a highly integrated design, the protocol chip has a built-in VBUS switch tube and current sense resistor, simplifying the peripheral circuit. Among them, the single-port C protocol chip adopts the thin package of ESP8, the A+C dual-port controller mainly adopts TSSOP and QFN package, and the three-port controller adopts QFN32 package.
It is worth mentioning that among the protocol chips launched by Yunsi Semiconductor, the four products of XPD737, XPD767, XPD930 and XPD977 are equipped with the XPD-LINK technology patented by Yunsi Semiconductor. This is a unique set of fast charging technology launched by Yunsi Semiconductor for multiple multi-port charging equipment applications, which can transfer information between chips through a single-wire bus, so that it can be simple and flexible to form a multi-USB-C port and a multi-USB-A port charging scheme.
Application case of cloud silicon semiconductor fast charging protocol chip
Since the global core shortage storm swept the world in the second half of 2020, the chip shortage in the fast charging source market has also spread rapidly, affecting many industrial chain enterprises. However, with years of technical accumulation and hard work in the field of PD protocol, and with the help of the resources of The Fuman Group's packaging and testing plants and the support of upstream fabs, Yunsi Semiconductor has achieved a counter-trend increase in shipments, and the monthly sales of USB PD fast charging protocol chips have exceeded 10 million.
Up to now, Yunsi Semiconductor's USB PD fast charging protocol chip has entered the supply chain of dozens of fast charging source manufacturers and brands, such as Nokia, AUKEY, Beth, Mingchuang Premium, RAVPower, Belkin, Verizon, Bull, Xiaomi, Pinsheng, NetEase Intelligent Manufacturing, Beijing Tokyo-made, Nubia, Philips, Lenovo, Momic, etc., with a cumulative shipment of hundreds of millions.
The following is the application case of the cloud silicon semiconductor protocol chip compiled by the charging head network according to the previous disassembly cases.
WING Cloud Silicon XPD320
The XPD320 is a multi-protocol port controller integrating USB Type-C, USB PD3.0, PPS, QC3.0+, QC3.0, QC2.0 Fast Charging Protocol, Huawei FCP/SCP Fast Charging Protocol, Samsung AFC Fast Charging Protocol, BC1.2 DCP and Apple 2.4A Charging Specification, providing cost-effective USB Type-C port charging solutions for AC-DC adapters, car chargers and other devices.
Specs of Cloud Silicon Semiconductor XPD320.
Application Cases:
1. Disassembly report: AT&T 20W PD fast charge charger 06457
WING Cloud Silicon XPD618
WING Cloud Silicon XPD618A/B is a multifunctionAL USB port controller with integrated USB Type-C, USB PD3.0, QC3.0/2.0 CLASS A fast charge protocol, Huawei FCP/SCP fast charge protocol, Samsung AFC fast charge protocol, BC1.2 DCP and Apple device 2.4A charging specification, the built-in Type-C protocol can support type-C devices to be inserted into the automatic wake-up system, and the plug is intelligently identified. Implement the connection. The XPD618A/B is available in an ESP8 package and supports 18W output power.
Detailed specifications of the XPD618.
1. Disassembly report: Gaston gerin with USB fast charging 86 panel
WING Cloud Silicon XPD636
The XPD636 chip adopts TSSOP16 package, supports C+A dual USB port applications, and supports full protocol fast charging when operating independently; its Type-C port application is the same as XPD618, no external components are required, and can easily pass USB PD 3.0 certification (TID number 1505).
Cloud Silicon Semiconductor XPD636 data information.
1. Disassembly report: air-J 18W 1A1C fast charger
2. Disassembly report: REMAX 20W 1A1C fast charger
WING Cloud Silicon XPD718
Yunsi Semiconductor XPD718 chip has passed USB PD3.0 certification, TID: 3479, support QC2.0, QC3.0, AFC, FCP, SCP, PD and PPS fast charging protocol, integrated 10mΩ VBUS path power switch, and integrated 10mΩ current sampling resistor, reduce the number of peripheral components, reduce costs, using ESPOP8 package.
Cloud Silicon Semiconductor XPD718 data information.
1. Disassembly report: Oreo 20W USB PD fast charger
WING Cloud Silicon XPD720
Cloud Silicon Semiconductor XPD720 chip has passed USB PD3.0 certification, TID: 3479, support QC2.0, QC3.0, AFC, FCP, SCP, HVSCP, PD and PPS and other fast charging protocols, internal integration of 10mΩ VBUS path power switch, and integrated 10mΩ current sense resistor, support perfect protection function, save the number of peripheral components, simplify the circuit, reduce costs. Available in ANOP8 package.
Specs of Cloud Silicon Semiconductor XPD720.
1. Disassembly report: Leqi leads the 20W USB PD fast charger
2. Disassembly report: Aoji 1A1C 32W fast charger
3. Disassembly report: Hailutong 20W PD fast charger
4. Disassembly report: comma mini 20W PD fast charger
5. Disassembly report: Momix mini 20W PD fast charger
6. Philips mini 20W fast charger, built-in national chip solution
7. Disassembly report: Belkin wireless charger original 20W charger
8. Disassembly report: PYS Pengyuansheng 20W PD fast charger
9. Disassembly report: Shengli 20W PD fast charger
10. Disassembly report: Jiayu 20W mini PD fast charger
11, Shenzhen manufacturers challenge the 20W fast charging ultra-thin limit, biscuit shape, stunning the world
12. Disassembly report: Pengyuansheng 20W PD fast charger
13. Disassembly report: Moso mini 20W PD fast charger
14. Disassembly report: GPE 20W PD fast charger
15. Disassembly report: Pinsheng mini 20W PD fast charger
16. Dismantling report: hoco. 30W 1A1C fast charge charger
17. Disassembly report: Pinsheng mini 20W Xiaoice crystal fast charger
WING Cloud Silicon XPD737
Silicon Semiconductor XPD737 is USB PD3.0 certified, TID: 3479. In addition to supporting mainstream fast charging protocols such as QC2.0/3.0/3.0+, AFC, FCP, SCP, HVSCP, PD and PPS, it also supports the Xiaomi CHARGE TURBO 27W protocol.
The XPD737 integrates a 10mΩ VBUS path transistor and a 10mΩ current sense resistor to support perfect protection functions, reduce the number of peripheral components, simplify the circuit, and reduce costs. Available in ANOP8 package.
1. Disassembly report: Huakesheng mini 33W fast charger
2. Disassembly report: Pengyuansheng 30W PD fast charger
3. Disassembly report: Huakesheng mini 30W gallium nitride fast charger
4. Disassembly report: Airanbo 30W Super GaN fast charger
5. Disassembly report: Pengyuansheng 30W gallium nitride fast charger
WING Cloud Silicon XPD738
Cloud Silicon Semiconductor XPD738 is used for 1C1A dual-port control, the chip passed the USB PD3.0 certification (TID: 3479), support PD2.0/3.0, PPS, QC2.0/3.0, FCP, SCP, HVSCP, AFC and other fast charging protocols, very suitable for application in 1C1A dual-port charging devices, support any single-port fast charging dual-port output 5V, in the A port connected to the Apple charging cable but not connected to the Apple mobile phone, C port still has fast charging.
Specs of Silicon Semiconductor XPD738.
1. Disassembly report: Lenovo 20W 1A1C fast charging socket
2. Disassembly report: Pinsheng mini 20W 1A1C fast charger
3. Disassembly report: Yubo 20W 1A1C fast charger
4. Disassembly report: Jiletang 20W 1A1C fast charger
5. Disassembly report: Zhidian Electronics 30W 1A1C fast charger
6. Disassembly report: Jiletang 30W 1A1C fast charger
7. Disassembly report: Momix 30W PD fast charger
8. Disassembly report: Beth 20W 1A1C fast charger
9. Disassembly report: Chuangfuyuan mini 33W 1A1C gallium nitride fast charger
10. Disassembly report: ON 20W 1A1C dual-port fast charging extension cable socket
11. Disassembly report: Beth 30W 2A1C fast charger
12. Disassembly report: Oribo MixSwitch 20W fast charging socket
13, the oil giant entered the fast charging market, Shell 20W mini charger disassembly
WING Cloud Silicon XPD750
Yunsi Semiconductor XPD750 chip has passed USB PD3.0 certification (TID: 3479), supports PD2.0/3.0, PPS, QC2.0/3.0, FCP, SCP, HVSCP, AFC and other fast charging protocols, integrates 10mΩ VBUS path power switch tube, and integrates 10mΩ current sense resistor, supporting perfect protection functions, saving the number of peripheral components, and reducing costs. Available in ANOP8 package.
Specs of Silicon Semiconductor XPD750.
1. Disassembly report: Nokia 20W PD fast charger
2. Disassembly report: Aoji 20W PD fast charger
3. Disassembly report: Bull Mini 20W PD fast charger
4. Disassembly report: WEMISS mini 20W PD fast charger
WING Cloud Silicon XPD767
The SILICON Semiconductor XPD767 chip has passed USB PD3.0 certification, TID: 3479. Support QC2.0/3.0/3.0+, AFC, FCP, SCP, HVSCP, PD and PPS and other fast charging protocols, internal integration of 10mΩ VBUS path power switch, and integrated 10mΩ current sense resistor, support perfect protection function, save the number of peripheral components, simplify the circuit, reduce costs. Supports TSSOP-20 and QFN20 packages.
Cloud Silicon Semiconductor XPD767 data information.
1. Dismantling report: hoco. 30W 1A1C fast charge charger
2. Disassembly report: Siemens 20W fast-charging font socket
WING Cloud Silicon XPD938
Cloud Silicon Semiconductor XPD938 has passed USB PD3.0 certification, TID: 5594. Support QC2.0/3.0/3.0+, AFC, FCP, SCP, HVSCP, PD2.0/3.0 and PPS and other fast charging protocols, internal integration of 10mΩ VBUS path power switch, and integrated 10mΩ current sense resistor, support perfect protection function, save the number of peripheral components, simplify the circuit, reduce costs. Available in TSSOP-20 and QNF4x4-20 packages.
Cloud Silicon Semiconductor XPD938 data information.
1. Disassembly report: Feifan Electronics 30W 1A1C fast charger
WING Cloud Silicon XPD977
Cloud Silicon Semiconductor XPD977 has passed USB PD3.0 certification, TID: 5594. Support XPD-LINKTM multi-chip interconnection communication technology, support QC2.0/3.0/3.0+, AFC, FCP, SCP, HVSCP, PD and PPS and other fast charging protocols, and also support Xiaomi CHARGE TURBO 27W protocol, Huawei 10V high-voltage SCP protocol, etc. On the left side of the picture is a current-sense resistor for current sensing of two USB-A ports.
The XPD977 internally integrates a 10mΩ VBUS path power switch, and integrates a 10mΩ current sense resistor with a built-in VPWR and VBUS dual discharge path. Support perfect protection functions, save the number of peripheral components, simplify the circuit, and reduce costs. Available in the QFN5X5-32 package.
1. Disassembly report: GreenLink 30W Smart Charging Magic Box Life (2A1C) USB socket
2. Disassembly report: Beth 30W 2A1C fast charger
Charging head net summary
Since the iPhone 12 series mobile phone canceled the standard charger, the market demand for third-party 20W PD fast charging has soared, the iPhone 13 series continues to adhere to the environmentally friendly route, and the 30W fast charger has once again become a hot spot in the market. However, the lack of core storms has caused many fast-charging chip manufacturers to miss the market opportunity, and Yunsi Semiconductor is one of the few companies in the industry to achieve sales growth against the trend.
In general, 20-30W PD fast charge charger is more sensitive to cost, and cost-effective solutions are favored by power supply manufacturers. To this end, most of the PD fast charging protocol chips launched by Yunsi Semiconductor adopt a highly integrated design, integrating VBUS switch MOS inside the chip, realizing a streamlined peripheral and reducing the cost of the overall solution.
In terms of performance, almost all of the protocol chips of Yunsi Semiconductor have passed the ASSOCIATION's USB PD3.0 certification, and have joined many mainstream fast charging protocols to improve the user experience, so they have been recognized by many power supply manufacturers and brands.