Kaiman launched QLC UFS 3.1 Flash memory and has provided customers with 512GB of samples

Kioxia announced the launch of a new version of UFS 3.1 Flash, which will use QLC technology. Jiaoxia said that at present, cutting-edge smartphones and other devices have high-density storage application requirements, and QLC technology can achieve the highest density in a single package.

ARMOR's UFS Proof of Concept (PoC) device is a prototype with a storage capacity of 512GB, utilizing KAIXIA's own BiCS FLASH flash 3D flash and QLC technology with a storage density of 1Tbit (128GB per Die) and has been providing samples to OEM customers. Kaoya believes this prototype can meet the growing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K video, and more. For the time being, Jiaoxia has not disclosed the performance indicators of this QLC UFS 3.1 flash memory, and the first products to be applied are likely to be smartphones.

Last year, Jiaoxia said that at this stage, embedded flash memory still urgently needs to improve performance and density. In gb-sized storage devices, UFS is increasingly becoming the preferred solution. In the flash storage market dominated by e-MMC and UFS, nearly 70% of the demand will come from UFS in 2021 and continues to grow.

In the past two years, the global market demand for semiconductors has soared, and Jiaoxia also hopes to seize the opportunity and seek further development. At present, the majority stake in Jiaoxia is held by a group of investors led by private equity firm Bain Capital, and there have been plans to conduct an initial public offering (IPO). With the good prospects of the industry, Jiaoxia has increased its investment in technology development and capacity expansion, while the valuation has also been rising. The valuation of Armor has almost doubled from the initial $16 billion to the current $30 billion.