Now the semiconductor production capacity is tight, for the enterprises that want to OEM, they must first advance the deposit to lock the production capacity, Apple, Nvidia, AMD and other companies are competing for the core 5nm or even 3nm production capacity, and the prepayment deposit is a must.
According to reports, although the Q1 quarter is the traditional off-season, the advance payment received by TSMC has reached a new high, and the major semiconductor design companies have advanced NT$150 billion, about 34.6 billion yuan, while the payment in Q3 last year was only NT$106.329 billion.
In the past 8 quarters, TSMC's advance payment amount has steadily increased, with a growth rate of more than 144% in each quarter, and customer prepaid lock-in orders have promoted TSMC's performance, and this year's revenue growth rate will still be as high as 26%.
Among the customers who pay the advance payment, Apple, AMD, NVIDIA, Qualcomm and other companies are the focus, of which Apple's main production capacity is now 5nm, and this year will preemptively use TSMC's latest 3nm process, but the A16 chip of the iPhone 14 cannot catch up.
AMD's process is mainly concentrated on 7nm, 6nm and 5nm at the end of the year, the recently released Ryzen 6000 upgraded 6nm, and the Zen4 at the end of the year will be on the 5nm process.
NVIDIA's orders in TSMC are not much, before it was mainly 7nm A100 core, but this year's RTX 40 series is reported to turn to TSMC 5nm.
As for Qualcomm' side, the main OEM of these two years is also Samsung 5nm and 4nm, but in the second half of this year, it is said that it will also turn to TSMC's 4nm process and launch an upgraded version of the Snapdragon 8 Gen 1.
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![TSMC increases 5nm process capacity monthly shipments to 150,000 wafers[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)