In order to compete for the top position of wafer foundry, TSMC and Samsung have invested heavily to gain a lead in technology. However, in the development of 3nm process nodes that the two sides are fully competing for, there has been news of development obstacles recently, and even affected the process of iPhone 14.
However, TSMC still has a very good performance in the optimization of 5nm.
According to TSMC's official website, the company today announced the launch of the N4X process, which is said to represent the highest performance and maximum frequency of the 5nm family.
N4X should be 4nm in TSMC's definition, but TSMC uses the 5nm family of expressions, which is to admit that it is actually a 5nm enhanced version.
In terms of microstructure, TSMC N4X optimizes the design and structure of components supporting high drive current and maximum frequency, optimizes the metal process of the rear section, and supports ultra-high density metal capacitors that transmit high power under extreme load.
In terms of metrics, the performance of the N4X is 15% better than that of the N5. Compared with N4P, the performance at 1.2V is also improved by 4%.
It is reported that N4X will enter trial production in the first half of 2023.
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![TSMC increases 5nm process capacity monthly shipments to 150,000 wafers[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)