Recently, the South China Morning Post, a well-known international media in Hong Kong, published an article saying that according to the Ministry of Industry and Information Technology (MIIT) of China, China has recently launched two domestic semiconductor lithography machinery, which have made major technological breakthroughs in deep ultraviolet (DUV) lithography technology and have independent intellectual property rights.
The two machines have yet to have a public market performance, but according to reliable sources, one of them is capable of operating at a wavelength of 193 nanometers (nm), with a resolution of less than 65nm and an overlap accuracy of less than 8nm; The other operates at a wavelength of 248 nm with a resolution of 110 nm and an overlap accuracy of 25 nm.
Observers note that while these achievements show China's progress in semiconductor manufacturing, they still lag behind the state-of-the-art DUV machinery offered by Netherlands company ASMLHolding. ASML's devices can operate at resolutions below 38 nm with an overlap accuracy of 1.3 nm. In addition, DUV technology is not as advanced as extreme ultraviolet (EUV) technology, which uses nearly 14 times more light at a wavelength of 13.5 nm than DUV.
China launched a domestic chip lithography machine to strive for semiconductor self-sufficiency
Recently, the Chinese government announced a "major technological breakthrough" in two domestically produced chip lithography machines, highlighting China's efforts to pursue technological self-sufficiency in the semiconductor field.
These two lithography machines are said to have achieved key technological breakthroughs and have independent intellectual property rights. Although it has not yet been officially put into the market, its R&D progress has undoubtedly brought new hope to China's semiconductor industry.
According to the Ministry of Industry and Information Technology (MIIT), one of the deep ultraviolet (DUV) lithography machines has a working wavelength of 193 nanometers, a resolution of less than 65 nanometers, and a stacking accuracy of less than 8 nanometers. Another DUV lithography machine uses a wavelength of 248 nanometers, with a resolution of 110 nanometers and a stacking accuracy of 25 nanometers.
These indicators show China's progress in chip manufacturing technology and reflect its determination to be self-reliant and self-reliant in science and technology. However, compared with the world's most advanced lithography equipment, there is still a significant gap in China's technical level.
The advanced DUV lithography machine produced by ASML in the Netherlands can reach a resolution of less than 38 nanometers, and the stacking accuracy is as low as 1.3 nanometers. In addition, extreme ultraviolet (EUV) lithography machines are more technologically advanced, with a wavelength of only 13.5 nanometers, which is almost 14 times sharper than the 195 nanometer wavelength of DUV lithography machines.
At present, the vast majority of the global lithography machine market is still dominated by ASML. Even though China's DUV lithography machine has made some progress, there is still a significant technological gap compared to ASML's EUV lithography machine.
In recent years, China has been striving to achieve technological self-sufficiency in the field of semiconductors, but progress has been relatively slow in the mass production of lithography systems. Domestic lithography machine manufacturers, such as Shanghai Microelectronics Equipment Group (SMEE), are regarded as the most promising companies in China to develop advanced lithography equipment. However, SMEE's technical level still lags far behind its international peers, especially leaders like ASML.
At present, almost all lithography machines in the Chinese market still rely on ASML imports, and the United States has imposed many restrictions on the supply of these equipment.
With further sanctions imposed by the United States, Chinese companies have been cut off from the channels to purchase advanced EUV lithography machines, and even face obstacles in the procurement of DUV lithography machines. In December last year, SMEE was United States blacklisted for trade, which undoubtedly exacerbated its difficulties in technology research and development and supply chain.
Despite international sanctions and technological blockades, SMEE has not stopped. According to the recent company registration, SMEE filed a patent for "EUV Radiation Generator and Lithography Equipment" in March last year, indicating that it is working towards advanced lithography technology. This trend also provides a glimmer of hope for China's development in the field of lithography machines.
In the face of United States suppression, China's independent research and development in the field of semiconductors can be described as a long way to go, but this does not mean that there is no way out. We can see that domestic lithography machines have made some progress, although there is still a big gap compared with the international advanced level, but this is the direction of Chinese enterprises to catch up.
At present, the performance of domestic lithography machines cannot reach the world's top standards, but the breakthroughs have proved the potential of China's scientific and technological independence. Next, the lithography machine industry needs to increase technology investment and promote the improvement of the industrial chain to achieve independent and controllable semiconductors in the true sense.
Prospects and challenges of China's semiconductor self-sufficiency
China's pursuit of self-sufficiency in the field of semiconductors is an important part of the national science and technology strategy. As the foundation of the modern science and technology industry, semiconductor chips have a significant impact on the country's scientific and technological strength, industrial upgrading and economic security.
However, the current global chip industry chain is highly dependent on international cooperation, especially in the field of lithography machines, European and American companies such as ASML in the Netherlands almost monopolize the most cutting-edge lithography equipment market. This has led to a technological blockade and trade restrictions on China's key aspects of chip manufacturing, which directly affects the independent innovation and development of China's high-tech industry.
In such an international context, the Chinese government and enterprises have accelerated the promotion of the chip self-sufficiency strategy. Through independent research and development of core equipment such as lithography machines, we strive to break the technological monopoly of international giants and provide a more stable and secure supply chain for China's chip manufacturing.
The breakthrough of the domestic lithography machine, although it has not yet reached the world's advanced level, is of great significance. It marks China's step by step towards self-sufficiency in semiconductor technology, paving the way for the future development of the technology industry.
The lithography machine is known as the "crown jewel of chip manufacturing", and its research and development is extremely difficult, involving multidisciplinary comprehensive technologies such as optics, precision machinery, materials, chemistry, and software.
Therefore, the lithography machine is not just a single equipment, but the crystallization of a huge technology and industrial chain system. In the case of ASML, the manufacture of its lithography machine requires the collaboration of hundreds of global suppliers and the integration of multiple cutting-edge technologies. This complexity makes it difficult for Chinese companies to break through lithography machine technology.
In addition to overcoming technical problems, the research and development of China's domestic lithography machine must also solve the problem of supporting the industrial chain. For example, the precision optical components, light source systems, special materials, control software and other fields involved in lithography machines all need a supply chain system that adapts to them.
In the current international situation, China's related enterprises are also subject to sanctions and technical blockades from the United States, which further increases the difficulty of technological research.
Despite the difficulties, the Chinese government has been vigorously supporting the research and development of domestically produced semiconductor equipment. Through the guidance of industrial policies, the investment of scientific research funds and the cultivation of talents, China's semiconductor industry has made breakthroughs in many fields.
Enterprises represented by Shanghai Microelectronics Equipment Group (SMEE) are narrowing the gap with the international advanced level step by step through independent innovation. SMEE's recent patent application for EUV lithography machine is a vivid portrayal of Chinese technology companies rising to the challenge.
In the long run, the localization of lithography machine is not only the self-help of the semiconductor industry, but also an important part of China's strategy to achieve a strong country in science and technology.
Although China's current lithography machine technology has not yet reached the world's top level, the gradual breakthrough and accumulation of these technologies have laid a solid foundation for China's semiconductor industry chain. Just as China's rise in high-tech fields such as high-speed rail and aerospace, the localization of lithography machines will also usher in its own glorious moment.
A little summary
In the context of the increasingly complex international situation, the independent process of China's semiconductor industry is particularly important.
At present, China's lithography machine research and development is still in the "catch-up" stage, and there is still a gap with the global leader. However, as long as we adhere to independent innovation, concentrate on tackling key technologies, and break through foreign technology blockades, China will have every opportunity to achieve from "following" to "running" or even "leading" in the semiconductor field in the future.
China's road to semiconductor self-sufficiency is destined to be challenging, but also promising. The progress made by domestic lithography machines demonstrates the perseverance and innovative spirit of Chinese technology enterprises.
In the future, China needs to continue to strengthen investment in scientific and technological research and development, cultivate more professional talents, and improve the supporting system of the industrial chain. Only in this way can we truly realize the independence and controllability of the semiconductor industry and grasp the initiative in global scientific and technological competition.
In general, the breakthrough of domestic lithography machine is not only a key step in China's semiconductor self-sufficiency strategy, but also a microcosm of China's science and technology industry's continuous pursuit of self-reliance and self-reliance. Although there is still a gap between us and the international advanced level, this is not an insurmountable gap.
As long as China has firm confidence, continues to promote scientific and technological innovation, and relies on national policy support and the efforts of enterprises, China's lithography machine technology will surely rank among the world's leading ranks in the future, helping China to realize the transformation from a "manufacturing power" to a "manufacturing power".