Semiconductor chip packaging will usher in a new pattern, and glass substrate technology is on the rise

IT House

2024-07-12 08:26Posted on the official account of Shandong IT Home

IT Home reported on July 12 that TrendForce released a blog post on July 10 that glass substrate technology has become a rising star in the field of advanced packaging due to its excellent performance and many advantages.

Glass substrate technology

The chip substrate is used to fix the die cut on the wafer, the protagonist of the final step of packaging, the more die fixed on the substrate, the more transistors in the whole chip.

Chip substrate materials have mainly undergone two iterations, starting with lead frames in the 70s and transitioning to ceramic substrates in the 90s, which are currently the most common organic material substrates.

In the packaging solution, glass substrates have more advantages than organic substrates, which are briefly summarized as follows:

Excellent mechanical, physical and optical properties

50% more die on the chip

The glass material is very flat, which improves the depth of focus of the lithography

Better thermal and mechanical stability

The spacing between through-glass vias (TGVs) can be less than 100 microns, which directly increases the interconnect density between wafers by a factor of 10

The coefficient of thermal expansion of the glass substrate is closer to that of the wafer, and higher temperature tolerance can reduce distortion by up to 50%.

Glass substrate technology is the new favorite

Intel, AMD, Samsung, LG Innotek and SKC's United States subsidiary Absolics are all paying close attention to glass substrate technology for advanced packaging.

Intel

In September 2023, Intel Corporation released the "Next Generation of Advanced Packaging Glass Substrate Technology", claiming that it could revolutionize the entire chip packaging field, and Intel plans to increase the number of chips with glass substrates, thereby reducing the carbon footprint and ensuring faster and more efficient performance.

Source: Intel

Intel plans to begin mass production of glass substrates by 2026 and has established a research facility in Arizona, United States.

Samsung

Samsung has commissioned its Samsung Electro-Mechanics division to initiate research and development on glass substrates and explore potential use cases for it in artificial intelligence and other emerging fields.

Image of Samsung's test chip in a glass-substrate package. Image source: SEDaily

Samsung will also leverage the results of the work of different divisions, such as the Display Division, to ensure the way glass substrates work together in the future. The company also expects to start mass production in 2026 and build a pilot line in September 2024.

SK hynix

SK hynix is also involved in this field through its United States subsidiary, Absolics. Absolics has invested $300 million in Covington, Georgia to develop a dedicated production facility and has begun mass production of prototype substrates.

SK hynix plans to start mass production in early 2025, making it one of the first companies to enter the glass substrate race.

AMD

AMD plans to launch glass substrates between 2025 and 2026 and is partnering with global component companies to maintain its leading position. According to Korea media reports, AMD is conducting performance evaluation tests on glass substrate samples from several major semiconductor substrate companies around the world, intending to introduce this advanced substrate technology into semiconductor manufacturing.

A new supply chain will take shape

With the emergence of new companies such as SCHMID, as well as the involvement of laser equipment suppliers, display manufacturers, and chemical suppliers, the industry is gradually forming some new supply chains and creating a diverse ecosystem around glass core substrates.

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