IT Home News on May 11, Apple's new iPad Pro launched this year has many highlights, including upgrading the M4 chip, using cutting-edge double-layer series OLED technology, etc., but one highlight is that the heat dissipation performance is increased by 20%, and one of the major contributors is the Apple logo on the back.
Apple says the new iPad Pro has higher performance and better thermal management than its predecessor. IT Home briefly introduces two improvements in heat dissipation, one is the addition of graphite sheets to the shell, and the other highlight is the Apple logo on the back as a heat sink to assist heat dissipation.
This Apple logo is made of copper and acts as a heatsink to help dissipate heat from the M4 chip and internal components. Although Apple officials did not disclose the contribution of the new copper Apple logo to heat dissipation, it is an innovative use, and SamMobile, the media that mainly reports Samsung news, can't help but sigh: "Apple's logo is more practical than Samsung's."