#2024北京国际车展#
Huawei released a patent for a heat sink for a chip, using superimposed packaging technology to add transistors to produce in-vehicle chips and improve processor performance. It is different from TSMC's technical route, but the effect is the same.
Huawei has announced a new patent for 3D stacked chip cooling technology. This patented technology belongs to the field of chip heat dissipation technology, by installing a thermal conductive sheet between two adjacent silicon wafers, the heat on the silicon wafer can be conducted to the thermal conductive wafer, reduce the temperature on the silicon wafer, improve the heat dissipation capacity of the chip, and then avoid a large amount of heat accumulation on the silicon wafer and the chip burns out.
It should be noted that Huawei and TSMC have different technical routes, but the effect is the same.
Huawei's new patent for 3D stacked chip cooling technology has the following advantages:
Double-sided heat dissipation: The chip module is dissipated on both sides through the top heat sink and the bottom heat dissipation, which greatly improves the heat dissipation efficiency.
Solve the problem of leakage and high stress: The connection between the channel parts and the bottom heat sink is wrapped in the plastic layer, which effectively solves the problems of leakage and high stress.
Simple integration: The chip heat dissipation device is simple to integrate, which is conducive to quantitative production.
