Dear colleagues, partners and friends in the industry,
The 2024 Wide Bandgap Semiconductor Technology Innovation and Application Development Summit Forum will be held from June 5 to 7, 2024 at Grand Skylight International Hotel, Beijing. The purpose of this conference is to focus on the industrial chain of key materials, intelligent equipment, core devices and other industrial chains in the field of wide bandgap semiconductors, and work with industry elites to unlock the realization path of cost reduction and efficiency increase and high-quality development of the mainland wide bandgap semiconductor industry chain, improve the overall efficiency of the wide bandgap semiconductor innovation chain, and build a multi-dimensional communication and cooperation platform for the industry!
During the conference, Huifeng Diamond Co., Ltd. will be exhibited at the booth to exhibit the latest products and technologies, we sincerely invite you to visit the booth to have in-depth exchanges and discussions with us, and explore the possibility of cooperation and development together.
In addition, Mr. Li Zhengxin, an expert from Huifeng Diamond Co., Ltd., will also deliver a wonderful speech on the theme of "Research and Development and Application of Micro and Nano Diamonds" at the conference, please look forward to it!
We look forward to your presence and believe that your participation will add more excitement and vitality to this conference. Let's work together to create brilliance!
Scan the QR code to register
01.
About Huifeng Diamond Co., Ltd
Huifeng Diamond is located in Zhecheng High-tech Diamond Industry Base, Shangqiu City, Henan Province, with 150 acres of garden-style standardized factory area, is the executive director unit of the Superhard Materials Branch of China Machine Tool Industry Association, one of the drafting units of the current national standard "Superhard Material Synthetic Diamond Powder", and has wholly-owned subsidiaries Henan Huifeng Diamond Co., Ltd., Shenzhen Huifeng Semiconductor Co., Ltd., The holding subsidiaries Henan Carat Diamond Co., Ltd. and Zhengzhou Technology Center were listed on the Beijing Stock Exchange in July 2022 (stock code: 839725).
02.
Wonderful preview of the exhibits
HFD-T (יהוה)
Product characteristics: The raw material is made of high-strength, high-purity high-quality diamond, with regular crystal form, concentrated particle size distribution, extremely low impurity content, good thermal stability and high wear resistance.
HFD-DW(金刚石线专用微粉)
Product characteristics: Using high-strength MBD series high-quality diamond as raw material, after special shaping and grading process, to eliminate large particles. The particle size distribution is concentrated, which increases the particle content of the effective grinding force and enhances the wear resistance.
HFD-B (יהוה)
Product characteristics: the product crystal form is regular, the particle size distribution is concentrated, the particle shape is equal area, and the impurity content is low.
Scan the QR code to register
03.
About the meeting
Meeting time and place
Meeting time
From June 5th to 7th, 2024, check in on the 5th
Meeting place
Grand Skylight International Hotel Beijing on the third floor of Grand Ballroom
(Building 10, China Aviation Technology Plaza, No. 15 Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing)
Organizational structure
Organizers
Zhongguancun Trina Wide Bandgap Semiconductor Technology Innovation Alliance
Organizers
Beijing North Huachuang Microelectronics Equipment Co., Ltd
Beijing Tianke Heda Semiconductor Co., Ltd
Co-organizers
Institute of Optoelectronic Technology, Beijing-Tianjin-Hebei National Technology Innovation Center
Henan United Precision Materials Co., Ltd
Tianjin Yufeng Carbon Co., Ltd
Huifeng Diamond Co., Ltd
Hangzhou Zhongsilicon Electronic Technology Co., Ltd
CETC Fenghua Information Equipment Co., Ltd
Topics to be discussed at the meeting
• Crystal growth, processing technology and related equipment technology;
• Core process technologies and equipment such as epitaxial material growth and chip manufacturing;
• Encapsulation materials, processes and equipment technologies;
• Reliability and failure analysis of wide bandgap semiconductor materials and devices;
• Application prospect of wide bandgap semiconductor devices;
• Analysis and improvement of product performance/yield/reliability and other factors;
• Thoughts and risks on production capacity;
• Solutions to promote process optimization, cost reduction and efficiency improvement;
• More hot topics......
Some of the attendees and invited guests
Liu Sheng is a professor at Wuhan University and an academician of the Chinese Academy of Sciences
Xiaolong Chen, Institute of Physics, Chinese Academy of Sciences, Researcher/Chairman of the Wide Bandgap Alliance
Lin Jian, Secretary General of Semiconductor Materials Branch of China Electronic Materials Industry Association
Ke Xu is a researcher at the Suzhou Institute of Nanotechnology, Chinese Academy of Sciences
Shen Bo is a professor at Peking University
Ma Lei, Professor, Tianjin University
Ou Xin is a researcher at the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Zhang Song is a researcher at Wuhan University of Technology
Lin Xuechun is a researcher at the Institute of Semiconductors, Chinese Academy of Sciences
He Weiwei, General Manager of Shenzhen Basic Semiconductor Co., Ltd
Deng Xiaojun is the deputy general manager of FEP business unit of Beijing North Huachuang Microelectronics Equipment Co., Ltd
Yang Mulong, Product Director of FEP Business Unit of Beijing North Huachuang Microelectronic Equipment Co., Ltd
Zhang Qingchun is a distinguished professor of Fudan University and chairman of Qingchun Semiconductor
Zheng Xuefeng, Professor, Xidian University
Ma Xiaohua is a professor at Xidian University
Yuan Jun is the person in charge of power devices in Hubei Jiufengshan Laboratory
Zhang Feng is a professor at Xiamen University
Jia Qiang, Associate Professor, Beijing University of Technology
Zhu Yangjun is the founder and chairman of Jiangsu Xin Changzheng Microelectronics Group Co., Ltd
Zhang Zesheng is the general manager of Beijing Lattice Field Semiconductor Co., Ltd
Huang Cunxin, Chief Expert of Sinoma High-tech Materials Co., Ltd
Jin Rui is a researcher at Beijing Institute of Smart Energy
Zhao Jinrong, Chairman of NAURA Technology Group Co., Ltd
Dong Boyu is the president of Beijing North Huachuang Microelectronics Equipment Co., Ltd
Yang Jian, General Manager of Beijing Tianke Heda Semiconductor Co., Ltd
Peng Tonghua is the executive deputy general manager of Beijing Tianke Heda Semiconductor Co., Ltd
Yang Chengjin, founder and chairman of Shenzhen Senguoke Technology Co., Ltd
Pan Yaobo, General Manager of CLP Compound Semiconductor Co., Ltd
Song Huaping, Chairman of Dongguan Zhongke Huizhu Semiconductor Co., Ltd
Fei Lei, General Manager of Jingfeng Xinchi (Shanghai) Semiconductor Technology Co., Ltd
Cai Jinrong is the general manager of Suzhou Youjing Semiconductor Technology Co., Ltd
Chen Tong, Chairman of Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd
Tang Deming, General Manager of Shanghai Youruipu Semiconductor Equipment Co., Ltd
Shanxi Shuoke Crystal Co., Ltd
Hebei Tongguang Semiconductor Co., Ltd
Guangdong Tianyu Semiconductor Co., Ltd
Hebei Puxing Electronic Technology Co., Ltd
Hantian Tiancheng Electronic Technology (Xiamen) Co., Ltd
Dongguan Zhongke Huizhu Semiconductor Co., Ltd
National Third Generation Semiconductor Technology Innovation Center (Suzhou)
Suzhou Nawei Technology Co., Ltd
Innoscience (Suzhou) Semiconductor Co., Ltd
Hunan Sanan Semiconductor Co., Ltd
The 13th Research Institute of China Electronics Technology Group Co., Ltd
The 55th Research Institute of China Electronics Technology Group Co., Ltd
Huairou Laboratory
Shenzhen Pinghu Laboratory
State Grid Smart Grid Research Institute Co., Ltd
Shanghai Jita Semiconductor Co., Ltd
Xinlian Integrated Circuit Manufacturing Co., Ltd
Shenzhen Founder Microelectronics Co., Ltd
Anhui Changfei Advanced Semiconductor Co., Ltd
Shanghai Zhanxin Electronic Technology Co., Ltd
Hangzhou Silan Microelectronics Co., Ltd
Zhejiang Silicon Science Semiconductor Co., Ltd
Sungrow Power Supply Co., Ltd
Jinlang Technology Co., Ltd
JA Solar Technology Co., Ltd
China FAW
Nezha car
Society of Automotive Engineers of China
Zhuzhou CRRC Times Semiconductor Co., Ltd
China Automobile (Beijing) Intelligent Network Research Institute Co., Ltd
China Automotive Chuangzhi Technology Co., Ltd
SAIC
NIO
Registration
Participation fee
Ordinary delegates: 2,000 yuan/person,
Alliance member units to participate in the meeting: 1600 yuan/person
(Including meals and meeting materials, accommodation is at your own expense)
Please scan the QR code below to complete the registration
Conference contact
Tel: (010) 50875766转721/722
E-mail:[email protected]
Business cooperation
Teacher Chen/13155757628
Register for the conference
Teacher Liu/18931699592
Teacher Hou/13811837211
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