As the vane of consumer electronics at the beginning of the year, the 2024 CES exhibition is coming as scheduled. At this exhibition, many storage manufacturers brought new products, and the electronic enthusiast network sorted out the display information of some manufacturers, and it can be seen that these manufacturers have actively deployed in AI, storage master control chips and embedded storage, SSD, etc., to a certain extent, indicating the next trend of the storage industry.
AI-powered storage
At the exhibition, SK hynix showcased its ultra-high-performance memory technology, which is the most critical technology for future AI infrastructure.
We know that SK hynix is the first in the industry to develop HBM products and has gained a lot. In order to strengthen its market position in this field, SK hynix has recently formulated a new development strategy to increase HBM shipments to 100 million units per year by 2030. To this end, SK hynix plans to increase investment in the construction of HBM production lines and expand production capacity in the next few years to meet market demand.
At the same time, SK hynix continues to develop new technologies to improve the performance and quality of HBM products. Strengthen cooperation with world-renowned manufacturers and increase expansion efforts in the global market, especially in China, North America, Europe and other regions with high demand for high-performance computing.
SK hynix showcased the HBM3E, which is the highest-performance memory available. HBM3E achieves the industry's highest data processing speed of 1.18TB/s, meeting the needs of the AI market to quickly process massive amounts of data. Compared with the previous generation HBM3, HBM3E is 1.3 times faster, has 1.4 times more data capacity, and uses the latest Advanced MR-MUF2 technology to improve heat dissipation performance by 10%. For users running AI solutions, HBM3E will help them realize the full potential of their systems.
Source: SK hynix
The company plans to start mass production of HBM3E products in the first half of this year and provide them to large technology companies in the field of AI.
Source: SK hynix
SK hynix also exhibited "CXL2 memory with next-generation interfaces," "CMS (Computational Memory Solution) prototype based on CXL computing functions," and "AiMX3," a low-cost, high-efficiency generative AI accelerator card based on PIM (Processing-In-Memory) semiconductors.
Source: SK hynix
Among them, AiMX (Accelerator-in-Memory based Accelerator) is a prototype accelerator card designed for large-scale language models using SK hynix's first PIM product, the GDDR6-AiM chip.
SK hynix plans to commercialize DDR5-based 96GB and 128GB CXL 2.0 memory solutions in the second half of this year and provide them to customers in the AI field. In addition, SK hynix has confirmed that it will start the development of the next-generation HBM4 in 2024.
When it comes to AI, not only GPUs and HBMs are used for AI training, but also AI servers need to improve the storage capacity of the system. At CES, as one of the few domestic manufacturers that can develop and mass-produce enterprise-level RDIMM and SSD at the same time, FORESEE, an industrial storage brand under Longsys, launched a product portfolio solution of DDR5 RDIMM and PCIe SSD to match the main requirements of large bandwidth and low latency in the field of AI servers.
Picture: FORESEE product family photo Source: Longsys
Recently, flagship mobile phones that support AI large model applications on mobile phones have been intensively released, so with the help of device-side SoC computing power, they also need the storage power of higher-speed DRAM and NAND Flash to support, such as the latest UFS 4.0 and LPDDR5. Taking DRAM as an example, a smartphone running a large model with 13 billion parameters needs to be equipped with at least 16GB of memory. Longsys expects to launch LPDDR5 products in 2024 to meet the higher storage needs of mobile phone manufacturers, and will continue to provide diversified options for the smart terminal market with a rich product portfolio such as embedded split storage and embedded composite storage.
闪存:UFS 4.0与PCIe 5.0
Kioxia highlights its broad portfolio of solid-state drive (SSD) and memory solutions, including new products, form factors, and standards designed for upcoming IT needs.
These include scalable Kioxia BiCS FLASH 3D flash technology solutions, including XL-FLASH and QLC technologies, flash solutions for automotive applications, including UFS 4.0, to support the market's changing automotive needs, a broad family of enterprise and data center SSDs that represent the latest standards, technologies, and form factors, and KIOXIA client SSDs, including the KIOXIA XG8 and BG6 series NVMe SSDs.
At CES 2024, Phison launched the PCIe 5.0 DRAM-Less Client SSD controller PS5031-E31T, which is the world's first PCIe 5.0 DRAM-Less 4CH client SSD controller with 7nm process.
In the current 3600MT/s NAND generation, the E31T SSD can achieve a performance of 10.8GB/s and a maximum capacity of 8TB, and after the release of the new generation NAND of 4800MT/s, the top speed of the E31T SSD will be increased to 14GB/s, pushing the PCIe 5.0 DRAM-Less SSD performance to a new level.
Embedded storage
At this exhibition, Kangying Semiconductor showcased its rich memory product line. The main products cover eMMC, eMMC industrial grade, Small PKG. eMMC, eMCP, ePOP, nMCP, UFS, MRAM, SPI NAND, LPDDR, DDR, SSD, PSSD, Memory card, memory module, etc. It is widely used in smart terminals, smart wearables, smart homes, Internet of Things, network communications, industrial control equipment, vehicle electronics, smart medical and other fields.
Source: Kangying Semiconductor
The Kangying Elf series embedded memory chip product line is characterized by miniaturized design, such as Small PKG. eMMC is smaller than normal eMMC, with a size as small as 9mm x 7.5mm x 0.8mm and a maximum capacity of 32GB. ePOP smart wearable Chuangxin Elf adopts a new design process, is vertically mounted on the SoC, with smaller size and lower power consumption, has a multi-category combination of LPDDR3 and 4X, and has passed the mainstream platform certification.
Source: Kangying Semiconductor
For the field of Internet of Things, it has launched nMCP with low latency, fast speed and long life, and for industrial scenarios, it has launched industrial-grade embedded memory chip products eMMC, SPI NAND, LPDDR, and eMMC with multi-specification capacity options and 64GB large capacity to meet Industry 5.0 applications. In addition, Kangying's C-end storage product line includes removable memory cards, memory modules, SSDs, etc., taking into account the characteristics of capacity, speed and durability.
Recently, Kangying has also gradually made efforts in the overseas storage market, and its products are positioned in the middle and high-end, which will be backed by solid product quality. In fact, domestic storage products are not only more and more refined in consumer electronics, but also more recognized by domestic customers in the fields of industry and automobiles.